Effect of trace silver on the conductivity and softening temperature of high conductivity and high heat resistance pure copper
As a conductor material for high-power electronic devices, pure copper requires both conductivity and softening temperature. The effects of 0% (7N Cu), 0.015% (Ag150), 0.030% (Ag300), 0.045% (Ag450) and 0.059% (Ag590) Ag on the microstructure, conductivity and softening temperature of pure copper we...
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2024-11-01
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| Series: | Journal of Materials Research and Technology |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785424024268 |
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| author | Weiqiang Li Haitao Liu Zhenguo Hou Zihao Zhang Jincan Dong Mengna Wang Huiwen Guo Kexing Song |
| author_facet | Weiqiang Li Haitao Liu Zhenguo Hou Zihao Zhang Jincan Dong Mengna Wang Huiwen Guo Kexing Song |
| author_sort | Weiqiang Li |
| collection | DOAJ |
| description | As a conductor material for high-power electronic devices, pure copper requires both conductivity and softening temperature. The effects of 0% (7N Cu), 0.015% (Ag150), 0.030% (Ag300), 0.045% (Ag450) and 0.059% (Ag590) Ag on the microstructure, conductivity and softening temperature of pure copper were studied. The results show that trace Ag can refine the microstructure of pure copper and improve the mechanical properties at room temperature and high temperature. The hardness values of 7N Cu, Ag150, Ag300, Ag450 and Ag590 were 112, 119.06, 122.14, 123.54 and 125.68HV, respectively, and the softening temperatures were 195, 310, 335, 344 and 345 °C, respectively. At the same time, the conductivity of the samples with different Ag content was more than 100.5 %IACS. The similar structure of Ag and Cu has little effect on the conductivity. On the one hand, the trace Ag element soluble in the matrix causes lattice distortion, inhibits recrystallization nucleation and grain boundary migration. On the other hand, the Ag element is polarized at the grain boundary, which reduces the grain boundary energy, decreases the atomic diffusion and increases the recrystallization temperature. |
| format | Article |
| id | doaj-art-67651392d71c43d19fae19bdf2abc65e |
| institution | OA Journals |
| issn | 2238-7854 |
| language | English |
| publishDate | 2024-11-01 |
| publisher | Elsevier |
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| series | Journal of Materials Research and Technology |
| spelling | doaj-art-67651392d71c43d19fae19bdf2abc65e2025-08-20T02:35:26ZengElsevierJournal of Materials Research and Technology2238-78542024-11-01334749476210.1016/j.jmrt.2024.10.156Effect of trace silver on the conductivity and softening temperature of high conductivity and high heat resistance pure copperWeiqiang Li0Haitao Liu1Zhenguo Hou2Zihao Zhang3Jincan Dong4Mengna Wang5Huiwen Guo6Kexing Song7. School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang, 471023, China; . Institute of Materials, Henan Academy of Sciences, Zhengzhou, 450046, China. School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang, 471023, China; . Institute of Materials, Henan Academy of Sciences, Zhengzhou, 450046, China; . Henan Key Laboratory of Advanced Conductor Materials, Zhengzhou, 450046, China; Corresponding author. School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang, 471023, China.. School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang, 471023, China. School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang, 471023, China. School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang, 471023, China. Chinalco Luoyang Copper Processing Co., Ltd, Luoyang, 471039, China. Chinalco Luoyang Copper Processing Co., Ltd, Luoyang, 471039, China. School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang, 471023, China; . Institute of Materials, Henan Academy of Sciences, Zhengzhou, 450046, China; . Henan Key Laboratory of Advanced Conductor Materials, Zhengzhou, 450046, China; Corresponding author. School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang, 471023, China.As a conductor material for high-power electronic devices, pure copper requires both conductivity and softening temperature. The effects of 0% (7N Cu), 0.015% (Ag150), 0.030% (Ag300), 0.045% (Ag450) and 0.059% (Ag590) Ag on the microstructure, conductivity and softening temperature of pure copper were studied. The results show that trace Ag can refine the microstructure of pure copper and improve the mechanical properties at room temperature and high temperature. The hardness values of 7N Cu, Ag150, Ag300, Ag450 and Ag590 were 112, 119.06, 122.14, 123.54 and 125.68HV, respectively, and the softening temperatures were 195, 310, 335, 344 and 345 °C, respectively. At the same time, the conductivity of the samples with different Ag content was more than 100.5 %IACS. The similar structure of Ag and Cu has little effect on the conductivity. On the one hand, the trace Ag element soluble in the matrix causes lattice distortion, inhibits recrystallization nucleation and grain boundary migration. On the other hand, the Ag element is polarized at the grain boundary, which reduces the grain boundary energy, decreases the atomic diffusion and increases the recrystallization temperature.http://www.sciencedirect.com/science/article/pii/S2238785424024268MicroalloyingPure copperSoftening resistanceRecrystallization； silverSolute segregation |
| spellingShingle | Weiqiang Li Haitao Liu Zhenguo Hou Zihao Zhang Jincan Dong Mengna Wang Huiwen Guo Kexing Song Effect of trace silver on the conductivity and softening temperature of high conductivity and high heat resistance pure copper Journal of Materials Research and Technology Microalloying Pure copper Softening resistance Recrystallization； silver Solute segregation |
| title | Effect of trace silver on the conductivity and softening temperature of high conductivity and high heat resistance pure copper |
| title_full | Effect of trace silver on the conductivity and softening temperature of high conductivity and high heat resistance pure copper |
| title_fullStr | Effect of trace silver on the conductivity and softening temperature of high conductivity and high heat resistance pure copper |
| title_full_unstemmed | Effect of trace silver on the conductivity and softening temperature of high conductivity and high heat resistance pure copper |
| title_short | Effect of trace silver on the conductivity and softening temperature of high conductivity and high heat resistance pure copper |
| title_sort | effect of trace silver on the conductivity and softening temperature of high conductivity and high heat resistance pure copper |
| topic | Microalloying Pure copper Softening resistance Recrystallization； silver Solute segregation |
| url | http://www.sciencedirect.com/science/article/pii/S2238785424024268 |
| work_keys_str_mv | AT weiqiangli effectoftracesilverontheconductivityandsofteningtemperatureofhighconductivityandhighheatresistancepurecopper AT haitaoliu effectoftracesilverontheconductivityandsofteningtemperatureofhighconductivityandhighheatresistancepurecopper AT zhenguohou effectoftracesilverontheconductivityandsofteningtemperatureofhighconductivityandhighheatresistancepurecopper AT zihaozhang effectoftracesilverontheconductivityandsofteningtemperatureofhighconductivityandhighheatresistancepurecopper AT jincandong effectoftracesilverontheconductivityandsofteningtemperatureofhighconductivityandhighheatresistancepurecopper AT mengnawang effectoftracesilverontheconductivityandsofteningtemperatureofhighconductivityandhighheatresistancepurecopper AT huiwenguo effectoftracesilverontheconductivityandsofteningtemperatureofhighconductivityandhighheatresistancepurecopper AT kexingsong effectoftracesilverontheconductivityandsofteningtemperatureofhighconductivityandhighheatresistancepurecopper |