Study on Power Cycling Lifetime of Automotive IGBT Devices
In order to investigate the power cycling failure mechanisms of bonding wires in automotive power modules, experiments were carried out based on electro-thermal FEM simulation, considering junction temperature variation (Δ<italic>T</italic><sub>j</sub>),bond wires current (&l...
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| Format: | Article |
| Language: | zho |
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Editorial Department of Electric Drive for Locomotives
2021-09-01
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| Series: | 机车电传动 |
| Subjects: | |
| Online Access: | http://edl.csrzic.com/thesisDetails#10.13890/j.issn.1000-128x.2021.05.029 |
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| _version_ | 1849729301171142656 |
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| author | Wangjun ZHOU Jinhui LU Haihui LUO Xiang TANG Chao FANG Haotao KE Yongdian PENG |
| author_facet | Wangjun ZHOU Jinhui LU Haihui LUO Xiang TANG Chao FANG Haotao KE Yongdian PENG |
| author_sort | Wangjun ZHOU |
| collection | DOAJ |
| description | In order to investigate the power cycling failure mechanisms of bonding wires in automotive power modules, experiments were carried out based on electro-thermal FEM simulation, considering junction temperature variation (Δ<italic>T</italic><sub>j</sub>),bond wires current (<italic>I</italic><sub>C</sub>), and medium temperature (<italic>T</italic><sub>m</sub>) as acceleration factors. Comparing with traditional power cycling test using large amount of samples, single bond wire were tested in this work, which greatly reduced the number of samples needed. The lift-off of bond wires were monitored through the variation of IGBT's <italic>V</italic><sub>CE(sat)</sub> value. The lifetime of power cycling test was extracted by using lifetime model and Weibull distribution.It can reduce the cost and period of experiments to 80% by using the new power cycling statistical method in this paper. |
| format | Article |
| id | doaj-art-65ffa061843945f09b27b0ce5becc3cf |
| institution | DOAJ |
| issn | 1000-128X |
| language | zho |
| publishDate | 2021-09-01 |
| publisher | Editorial Department of Electric Drive for Locomotives |
| record_format | Article |
| series | 机车电传动 |
| spelling | doaj-art-65ffa061843945f09b27b0ce5becc3cf2025-08-20T03:09:15ZzhoEditorial Department of Electric Drive for Locomotives机车电传动1000-128X2021-09-0118318820898737Study on Power Cycling Lifetime of Automotive IGBT DevicesWangjun ZHOUJinhui LUHaihui LUOXiang TANGChao FANGHaotao KEYongdian PENGIn order to investigate the power cycling failure mechanisms of bonding wires in automotive power modules, experiments were carried out based on electro-thermal FEM simulation, considering junction temperature variation (Δ<italic>T</italic><sub>j</sub>),bond wires current (<italic>I</italic><sub>C</sub>), and medium temperature (<italic>T</italic><sub>m</sub>) as acceleration factors. Comparing with traditional power cycling test using large amount of samples, single bond wire were tested in this work, which greatly reduced the number of samples needed. The lift-off of bond wires were monitored through the variation of IGBT's <italic>V</italic><sub>CE(sat)</sub> value. The lifetime of power cycling test was extracted by using lifetime model and Weibull distribution.It can reduce the cost and period of experiments to 80% by using the new power cycling statistical method in this paper.http://edl.csrzic.com/thesisDetails#10.13890/j.issn.1000-128x.2021.05.029automotive IGBTdegradation mechanismwire bondingsingle bonding wire samplespower cycling lifetimesimulation |
| spellingShingle | Wangjun ZHOU Jinhui LU Haihui LUO Xiang TANG Chao FANG Haotao KE Yongdian PENG Study on Power Cycling Lifetime of Automotive IGBT Devices 机车电传动 automotive IGBT degradation mechanism wire bonding single bonding wire samples power cycling lifetime simulation |
| title | Study on Power Cycling Lifetime of Automotive IGBT Devices |
| title_full | Study on Power Cycling Lifetime of Automotive IGBT Devices |
| title_fullStr | Study on Power Cycling Lifetime of Automotive IGBT Devices |
| title_full_unstemmed | Study on Power Cycling Lifetime of Automotive IGBT Devices |
| title_short | Study on Power Cycling Lifetime of Automotive IGBT Devices |
| title_sort | study on power cycling lifetime of automotive igbt devices |
| topic | automotive IGBT degradation mechanism wire bonding single bonding wire samples power cycling lifetime simulation |
| url | http://edl.csrzic.com/thesisDetails#10.13890/j.issn.1000-128x.2021.05.029 |
| work_keys_str_mv | AT wangjunzhou studyonpowercyclinglifetimeofautomotiveigbtdevices AT jinhuilu studyonpowercyclinglifetimeofautomotiveigbtdevices AT haihuiluo studyonpowercyclinglifetimeofautomotiveigbtdevices AT xiangtang studyonpowercyclinglifetimeofautomotiveigbtdevices AT chaofang studyonpowercyclinglifetimeofautomotiveigbtdevices AT haotaoke studyonpowercyclinglifetimeofautomotiveigbtdevices AT yongdianpeng studyonpowercyclinglifetimeofautomotiveigbtdevices |