Study on Power Cycling Lifetime of Automotive IGBT Devices
In order to investigate the power cycling failure mechanisms of bonding wires in automotive power modules, experiments were carried out based on electro-thermal FEM simulation, considering junction temperature variation (Δ<italic>T</italic><sub>j</sub>),bond wires current (&l...
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| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | zho |
| Published: |
Editorial Department of Electric Drive for Locomotives
2021-09-01
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| Series: | 机车电传动 |
| Subjects: | |
| Online Access: | http://edl.csrzic.com/thesisDetails#10.13890/j.issn.1000-128x.2021.05.029 |
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| Summary: | In order to investigate the power cycling failure mechanisms of bonding wires in automotive power modules, experiments were carried out based on electro-thermal FEM simulation, considering junction temperature variation (Δ<italic>T</italic><sub>j</sub>),bond wires current (<italic>I</italic><sub>C</sub>), and medium temperature (<italic>T</italic><sub>m</sub>) as acceleration factors. Comparing with traditional power cycling test using large amount of samples, single bond wire were tested in this work, which greatly reduced the number of samples needed. The lift-off of bond wires were monitored through the variation of IGBT's <italic>V</italic><sub>CE(sat)</sub> value. The lifetime of power cycling test was extracted by using lifetime model and Weibull distribution.It can reduce the cost and period of experiments to 80% by using the new power cycling statistical method in this paper. |
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| ISSN: | 1000-128X |