Modeling and Simulation for Predicting Thermo-Mechanical Behavior of Wafer-Level Cu-PI RDLs During Manufacturing
The development of chip manufacturing and advanced packaging technologies has significantly changed redistribution layers (RDLs), leading to shrinking line width/spacing, increasing the number of build-up layers and package size, and introducing organic materials such as polyimide (PI) for dielectri...
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| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-05-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/16/5/582 |
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