APA (7th ed.) Citation

Chu, X., Wang, S., Li, C., Wang, Z., Ma, S., Wu, D., . . . You, B. Modeling and Simulation for Predicting Thermo-Mechanical Behavior of Wafer-Level Cu-PI RDLs During Manufacturing. MDPI AG.

Chicago Style (17th ed.) Citation

Chu, Xianglong, Shitao Wang, Chunlei Li, Zhizhen Wang, Shenglin Ma, Daowei Wu, Hai Yuan, and Bin You. Modeling and Simulation for Predicting Thermo-Mechanical Behavior of Wafer-Level Cu-PI RDLs During Manufacturing. MDPI AG.

MLA (9th ed.) Citation

Chu, Xianglong, et al. Modeling and Simulation for Predicting Thermo-Mechanical Behavior of Wafer-Level Cu-PI RDLs During Manufacturing. MDPI AG.