3D laser structuring of supermetalphobic microstructures inside elastomer for multilayer high-density interconnect soft electronics
High-density interconnect (HDI) soft electronics that can integrate multiple individual functions into one miniaturized monolithic system is promising for applications related to smart healthcare, soft robotics, and human-machine interactions. However, despite the recent advances, the development of...
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| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IOP Publishing
2025-01-01
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| Series: | International Journal of Extreme Manufacturing |
| Subjects: | |
| Online Access: | https://doi.org/10.1088/2631-7990/ada835 |
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