As-deposited and dewetted Cu layers on plasma treated glass: Adhesion study and its effect on biological response
Improving the adhesion of nanosized copper films to a glass substrate is vital for their application in electronics and medicine, as it enhances their overall reliability. For this purpose, we employed Ar plasma etching (240 s) and magnetron sputtering to create copper layers on a glass substrate. F...
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Elsevier
2024-12-01
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| Series: | Applied Surface Science Advances |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2666523924000679 |
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| author | Alena Reznickova Veronika Lacmanova Marie Hubalek Kalbacova Petr Hausild Jiri Nohava Zdenka Kolska Anna Kutova Petr Slepicka |
| author_facet | Alena Reznickova Veronika Lacmanova Marie Hubalek Kalbacova Petr Hausild Jiri Nohava Zdenka Kolska Anna Kutova Petr Slepicka |
| author_sort | Alena Reznickova |
| collection | DOAJ |
| description | Improving the adhesion of nanosized copper films to a glass substrate is vital for their application in electronics and medicine, as it enhances their overall reliability. For this purpose, we employed Ar plasma etching (240 s) and magnetron sputtering to create copper layers on a glass substrate. Furthermore, we investigated the effect of subsequent solid state dewetting (at 300 °C) of Cu nanolayers on the interface stability. Increasing the sputtering time resulted in elevated copper concentration, UV-Vis absorption, conductivity, and surface roughness. The as-deposited and dewetted samples exhibited very good wettability with water contact angles below 60°. Importantly, plasma treatment improved the adhesion of the Cu layers to the glass. Subsequent dewetting accelerated surface diffusion and the oxidation of Cu atoms, causing structural and morphological changes. The presence of CuO after dewetting caused loss of the surface plasmon resonance (SPR) band in the UV-Vis spectrum and a decrease in sample conductivity due to the transformation of the copper layer from a metal to an oxide. Biological testing revealed a more pronounced bactericidal effect for the as-deposited Cu layer against E. coli and S. epidermidis on contrary to dewetted samples. The similar cytotoxic trend was observed for human dermal fibroblasts and hepatocytes. Nonetheless, biological testing confirmed better cell adhesion on dewetted Cu layers compared to the as-deposited ones. Therefore, our copper nanostructured samples could find application as antibacterial coatings of biomedical devices. |
| format | Article |
| id | doaj-art-63e71ede69804f5d9dcbdd0c139bc296 |
| institution | OA Journals |
| issn | 2666-5239 |
| language | English |
| publishDate | 2024-12-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Applied Surface Science Advances |
| spelling | doaj-art-63e71ede69804f5d9dcbdd0c139bc2962025-08-20T02:21:07ZengElsevierApplied Surface Science Advances2666-52392024-12-012410063910.1016/j.apsadv.2024.100639As-deposited and dewetted Cu layers on plasma treated glass: Adhesion study and its effect on biological responseAlena Reznickova0Veronika Lacmanova1Marie Hubalek Kalbacova2Petr Hausild3Jiri Nohava4Zdenka Kolska5Anna Kutova6Petr Slepicka7Department of Solid State Engineering, University of Chemistry and Technology Prague, Prague 166 28, Czech Republic; Faculty of Science, CENAB, J. E. Purkyne University, Usti nad Labem 400 96, Czech Republic; Corresponding author at: Department of Solid State Engineering, University of Chemistry and Technology Prague, Prague 166 28, Czech Republic.Department of Solid State Engineering, University of Chemistry and Technology Prague, Prague 166 28, Czech RepublicInstitute of Pathological Physiology, 1st Faculty of Medicine, Charles University, Czech RepublicDepartment of Materials, Czech Technical University in Prague, Prague 120 00, Czech RepublicAnton Paar TriTec, Vernets 6, Corcelles CH 2035, SwitzerlandFaculty of Science, CENAB, J. E. Purkyne University, Usti nad Labem 400 96, Czech RepublicDepartment of Solid State Engineering, University of Chemistry and Technology Prague, Prague 166 28, Czech RepublicDepartment of Solid State Engineering, University of Chemistry and Technology Prague, Prague 166 28, Czech RepublicImproving the adhesion of nanosized copper films to a glass substrate is vital for their application in electronics and medicine, as it enhances their overall reliability. For this purpose, we employed Ar plasma etching (240 s) and magnetron sputtering to create copper layers on a glass substrate. Furthermore, we investigated the effect of subsequent solid state dewetting (at 300 °C) of Cu nanolayers on the interface stability. Increasing the sputtering time resulted in elevated copper concentration, UV-Vis absorption, conductivity, and surface roughness. The as-deposited and dewetted samples exhibited very good wettability with water contact angles below 60°. Importantly, plasma treatment improved the adhesion of the Cu layers to the glass. Subsequent dewetting accelerated surface diffusion and the oxidation of Cu atoms, causing structural and morphological changes. The presence of CuO after dewetting caused loss of the surface plasmon resonance (SPR) band in the UV-Vis spectrum and a decrease in sample conductivity due to the transformation of the copper layer from a metal to an oxide. Biological testing revealed a more pronounced bactericidal effect for the as-deposited Cu layer against E. coli and S. epidermidis on contrary to dewetted samples. The similar cytotoxic trend was observed for human dermal fibroblasts and hepatocytes. Nonetheless, biological testing confirmed better cell adhesion on dewetted Cu layers compared to the as-deposited ones. Therefore, our copper nanostructured samples could find application as antibacterial coatings of biomedical devices.http://www.sciencedirect.com/science/article/pii/S2666523924000679GlassCopperSputteringAnnealingAdhesionCytotoxicity |
| spellingShingle | Alena Reznickova Veronika Lacmanova Marie Hubalek Kalbacova Petr Hausild Jiri Nohava Zdenka Kolska Anna Kutova Petr Slepicka As-deposited and dewetted Cu layers on plasma treated glass: Adhesion study and its effect on biological response Applied Surface Science Advances Glass Copper Sputtering Annealing Adhesion Cytotoxicity |
| title | As-deposited and dewetted Cu layers on plasma treated glass: Adhesion study and its effect on biological response |
| title_full | As-deposited and dewetted Cu layers on plasma treated glass: Adhesion study and its effect on biological response |
| title_fullStr | As-deposited and dewetted Cu layers on plasma treated glass: Adhesion study and its effect on biological response |
| title_full_unstemmed | As-deposited and dewetted Cu layers on plasma treated glass: Adhesion study and its effect on biological response |
| title_short | As-deposited and dewetted Cu layers on plasma treated glass: Adhesion study and its effect on biological response |
| title_sort | as deposited and dewetted cu layers on plasma treated glass adhesion study and its effect on biological response |
| topic | Glass Copper Sputtering Annealing Adhesion Cytotoxicity |
| url | http://www.sciencedirect.com/science/article/pii/S2666523924000679 |
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