APA (7th ed.) Citation

Liu, B., Jiang, K., Chen, Y., Yang, H., Wang, Y., Sun, K., & Li, H. Simulated and experimental study of the chip deformation mechanisms of monocrystalline Cu. AIP Publishing LLC.

Chicago Style (17th ed.) Citation

Liu, Bing, Kai Jiang, Yuxiang Chen, Haijie Yang, Yurong Wang, Keyu Sun, and Haiyang Li. Simulated and Experimental Study of the Chip Deformation Mechanisms of Monocrystalline Cu. AIP Publishing LLC.

MLA (9th ed.) Citation

Liu, Bing, et al. Simulated and Experimental Study of the Chip Deformation Mechanisms of Monocrystalline Cu. AIP Publishing LLC.