APA (7th ed.) Citation

Cheng, L., Sun, H., Dai, X., & Wei, B. Numerical Simulation of Thermal Cycling and Vibration Effects on Solder Layer Reliability in High-Power Diode Lasers for Space Applications. MDPI AG.

Chicago Style (17th ed.) Citation

Cheng, Lei, Huaqing Sun, Xuanjun Dai, and Bingxing Wei. Numerical Simulation of Thermal Cycling and Vibration Effects on Solder Layer Reliability in High-Power Diode Lasers for Space Applications. MDPI AG.

MLA (9th ed.) Citation

Cheng, Lei, et al. Numerical Simulation of Thermal Cycling and Vibration Effects on Solder Layer Reliability in High-Power Diode Lasers for Space Applications. MDPI AG.