K/Ka-band compact low-profile dual differential-fed split ring resonator magnetic-dipole antenna with UWB-frequency-tuning and broad scanning capabilities

A unique split ring resonator magnetic-dipole (SRR-MD) patch antenna is proposed in this paper. The dual differential-fed SRR-MD antenna boasts a high gain of 8 dB and, in contrast to comparable designs, provides a more compact and low-profile structure. Compared to other designs, this design obtain...

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Bibliographic Details
Main Authors: Amir Reza Dastkhosh, Zhong-Xiang Zhang, Mehdi Naseh, Véronique Moeyaert, Fujiang Lin
Format: Article
Language:English
Published: Elsevier 2025-09-01
Series:Results in Engineering
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Online Access:http://www.sciencedirect.com/science/article/pii/S2590123025027161
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Summary:A unique split ring resonator magnetic-dipole (SRR-MD) patch antenna is proposed in this paper. The dual differential-fed SRR-MD antenna boasts a high gain of 8 dB and, in contrast to comparable designs, provides a more compact and low-profile structure. Compared to other designs, this design obtains superior port isolation (>90 dB) and improved isolation between co-polarization and cross-polarization radiation patterns. Furthermore, the antenna provides a broad circularly polarized scanning angle (θ = ±80°), with a half-power beamwidth and efficiency above 90 degrees and 95%, respectively. The suggested antenna enables ultrawide-frequency tuning, achieving a 67% tuning range, the most among comparable designs which encompasses the whole K/Ka band from 20 GHz to 40 GHz by adjustments to the capacitances of the structure. It has been analyzed, designed, simulated, fabricated, and tested for applications in LEO SatCom mobile terminals, and its circuit model has been presented. The empirical data validate the simulations. The antenna features a compact and low-profile configuration (0.27λ0 × 0.27λ0 × 0.02λ0) characterized by broadside radiation and dual differential feeding, which enhances its compatibility with power amplifiers (PAs), low-noise amplifiers (LNAs), and transceiver integrated circuits (ICs). This design renders it particularly appropriate for glass-based antenna-in-package (AiP) applications that necessitate the use of thin substrates measuring 300 μm.
ISSN:2590-1230