Hybrid Bonding With Polymeric Interlayer Dielectric Layers Patterned by Nanoimprint Lithography
Recent advancements in semiconductor technology have shifted the focus of innovation toward advanced packaging technologies featuring heterogeneous integration. Among these, hybrid bonding has garnered significant attention due to its potential for achieving higher integration density and reduced in...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2025-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/11087484/ |
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