Through-mask electrochemical machining of micro-dimple arrays with synchronization of power switching and cathode movements
Micro-dimple arrays with specific shapes and dimensions are crucial for reducing wear and vibration. Through-mask electrochemical machining (TMECM) using flexible cathodes removes materials based on anodic dissolution and allows for efficient processing of large-area micro-dimple arrays. However, th...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
SAGE Publishing
2025-07-01
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| Series: | Advances in Mechanical Engineering |
| Online Access: | https://doi.org/10.1177/16878132251356005 |
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