Research Progress on the Effect of Addition of Alloy Elements on Electrochemical Migration of Tin - Based Electronic Materials
Tin - based electronic materials are one of the core materials for electronic component packaging and welding. Aiming at the electrochemical migration failure of tin - based electronic materials in service, the main failure forms, electrochemical migration mechanism, research methods, evaluation met...
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| Format: | Article |
| Language: | zho |
| Published: |
Editorial Department of Materials Protection
2021-10-01
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| Series: | Cailiao Baohu |
| Subjects: | |
| Online Access: | http://www.mat-pro.com/fileup/1001-1560/PDF/20211022.pdf |
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