Research Progress on the Effect of Addition of Alloy Elements on Electrochemical Migration of Tin - Based Electronic Materials
Tin - based electronic materials are one of the core materials for electronic component packaging and welding. Aiming at the electrochemical migration failure of tin - based electronic materials in service, the main failure forms, electrochemical migration mechanism, research methods, evaluation met...
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| Format: | Article |
| Language: | zho |
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Editorial Department of Materials Protection
2021-10-01
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| Series: | Cailiao Baohu |
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| Online Access: | http://www.mat-pro.com/fileup/1001-1560/PDF/20211022.pdf |
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| author | WANG Hong, WU Ying, LIAO Bo - kai, GUO Xing - peng |
| author_facet | WANG Hong, WU Ying, LIAO Bo - kai, GUO Xing - peng |
| author_sort | WANG Hong, WU Ying, LIAO Bo - kai, GUO Xing - peng |
| collection | DOAJ |
| description | Tin - based electronic materials are one of the core materials for electronic component packaging and welding. Aiming at the electrochemical migration failure of tin - based electronic materials in service, the main failure forms, electrochemical migration mechanism, research methods, evaluation methods and inhibition methods of tin - based electronic materials were discussed in this paper. Meanwhile, the effects of different alloying elements on the electrochemical migration behavior of tin - based electronic materials were reviewed. |
| format | Article |
| id | doaj-art-607ce18dcb76481ea1deb509e13fd4fa |
| institution | OA Journals |
| issn | 1001-1560 |
| language | zho |
| publishDate | 2021-10-01 |
| publisher | Editorial Department of Materials Protection |
| record_format | Article |
| series | Cailiao Baohu |
| spelling | doaj-art-607ce18dcb76481ea1deb509e13fd4fa2025-08-20T02:35:57ZzhoEditorial Department of Materials ProtectionCailiao Baohu1001-15602021-10-01541011710.16577/j.cnki.42-1215/tb.2021.10.022Research Progress on the Effect of Addition of Alloy Elements on Electrochemical Migration of Tin - Based Electronic MaterialsWANG Hong, WU Ying, LIAO Bo - kai, GUO Xing - peng0a. School of Chemistry and Chemical Engineering; b. Guangzhou University - Joint Research Institute of Guangdong Corrosion Science and Technology Innovation Research Institute, Guangzhou University, Guangzhou 510006, ChinaTin - based electronic materials are one of the core materials for electronic component packaging and welding. Aiming at the electrochemical migration failure of tin - based electronic materials in service, the main failure forms, electrochemical migration mechanism, research methods, evaluation methods and inhibition methods of tin - based electronic materials were discussed in this paper. Meanwhile, the effects of different alloying elements on the electrochemical migration behavior of tin - based electronic materials were reviewed.http://www.mat-pro.com/fileup/1001-1560/PDF/20211022.pdfmicroelectronic system; tin alloy; electrochemical migration; alloying addition |
| spellingShingle | WANG Hong, WU Ying, LIAO Bo - kai, GUO Xing - peng Research Progress on the Effect of Addition of Alloy Elements on Electrochemical Migration of Tin - Based Electronic Materials Cailiao Baohu microelectronic system; tin alloy; electrochemical migration; alloying addition |
| title | Research Progress on the Effect of Addition of Alloy Elements on Electrochemical Migration of Tin - Based Electronic Materials |
| title_full | Research Progress on the Effect of Addition of Alloy Elements on Electrochemical Migration of Tin - Based Electronic Materials |
| title_fullStr | Research Progress on the Effect of Addition of Alloy Elements on Electrochemical Migration of Tin - Based Electronic Materials |
| title_full_unstemmed | Research Progress on the Effect of Addition of Alloy Elements on Electrochemical Migration of Tin - Based Electronic Materials |
| title_short | Research Progress on the Effect of Addition of Alloy Elements on Electrochemical Migration of Tin - Based Electronic Materials |
| title_sort | research progress on the effect of addition of alloy elements on electrochemical migration of tin based electronic materials |
| topic | microelectronic system; tin alloy; electrochemical migration; alloying addition |
| url | http://www.mat-pro.com/fileup/1001-1560/PDF/20211022.pdf |
| work_keys_str_mv | AT wanghongwuyingliaobokaiguoxingpeng researchprogressontheeffectofadditionofalloyelementsonelectrochemicalmigrationoftinbasedelectronicmaterials |