Ultrasonic Wire Bonding Technology in High-power IGBT Module Assembly
It introduces the mechanism of ultrasonic wire bonding, analyzes the material properties and the interface characteristics of the bonding for high-power IGBT module, and discusses the effects of bonding parameters on bonding strength. Several detection methods of bonding points’ strength are recomme...
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| Main Authors: | , |
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| Format: | Article |
| Language: | zho |
| Published: |
Editorial Office of Control and Information Technology
2011-01-01
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| Series: | Kongzhi Yu Xinxi Jishu |
| Subjects: | |
| Online Access: | http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2011.02.003 |
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