Ultrasonic Wire Bonding Technology in High-power IGBT Module Assembly
It introduces the mechanism of ultrasonic wire bonding, analyzes the material properties and the interface characteristics of the bonding for high-power IGBT module, and discusses the effects of bonding parameters on bonding strength. Several detection methods of bonding points’ strength are recomme...
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| Main Authors: | , |
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| Format: | Article |
| Language: | zho |
| Published: |
Editorial Office of Control and Information Technology
2011-01-01
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| Series: | Kongzhi Yu Xinxi Jishu |
| Subjects: | |
| Online Access: | http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2011.02.003 |
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| _version_ | 1849224729901137920 |
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| author | 覃荣震 张泉 |
| author_facet | 覃荣震 张泉 |
| author_sort | 覃荣震 |
| collection | DOAJ |
| description | It introduces the mechanism of ultrasonic wire bonding, analyzes the material properties and the interface characteristics of the bonding for high-power IGBT module, and discusses the effects of bonding parameters on bonding strength. Several detection methods of bonding points’ strength are recommended, the parameters are further adjusted through the test results, so that the optimal wire bonding process of high-power IGBT modules can be achieved. |
| format | Article |
| id | doaj-art-6074f0a964224f39bac8a7b739c46d89 |
| institution | Kabale University |
| issn | 2096-5427 |
| language | zho |
| publishDate | 2011-01-01 |
| publisher | Editorial Office of Control and Information Technology |
| record_format | Article |
| series | Kongzhi Yu Xinxi Jishu |
| spelling | doaj-art-6074f0a964224f39bac8a7b739c46d892025-08-25T06:56:01ZzhoEditorial Office of Control and Information TechnologyKongzhi Yu Xinxi Jishu2096-54272011-01-01222582336296Ultrasonic Wire Bonding Technology in High-power IGBT Module Assembly覃荣震张泉It introduces the mechanism of ultrasonic wire bonding, analyzes the material properties and the interface characteristics of the bonding for high-power IGBT module, and discusses the effects of bonding parameters on bonding strength. Several detection methods of bonding points’ strength are recommended, the parameters are further adjusted through the test results, so that the optimal wire bonding process of high-power IGBT modules can be achieved.http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2011.02.003wire bondinghigh-power IGBTmodule assembly |
| spellingShingle | 覃荣震 张泉 Ultrasonic Wire Bonding Technology in High-power IGBT Module Assembly Kongzhi Yu Xinxi Jishu wire bonding high-power IGBT module assembly |
| title | Ultrasonic Wire Bonding Technology in High-power IGBT Module Assembly |
| title_full | Ultrasonic Wire Bonding Technology in High-power IGBT Module Assembly |
| title_fullStr | Ultrasonic Wire Bonding Technology in High-power IGBT Module Assembly |
| title_full_unstemmed | Ultrasonic Wire Bonding Technology in High-power IGBT Module Assembly |
| title_short | Ultrasonic Wire Bonding Technology in High-power IGBT Module Assembly |
| title_sort | ultrasonic wire bonding technology in high power igbt module assembly |
| topic | wire bonding high-power IGBT module assembly |
| url | http://ctet.csrzic.com/thesisDetails#10.13889/j.issn.2095-3631.2011.02.003 |
| work_keys_str_mv | AT tánróngzhèn ultrasonicwirebondingtechnologyinhighpowerigbtmoduleassembly AT zhāngquán ultrasonicwirebondingtechnologyinhighpowerigbtmoduleassembly |