Blue Laser Diode Annealed Top-Gate Low Temperature Poly-Si TFTs With Low Resistance of Source/Drain From Deposited n+ Layer

In this letter, a high performance and large area feasible top-gate low-temperature polysilicon thin film transistor (LTPS TFT) technology is reported. The poly-Si active layer was formed by crystallizing the plasma enhanced chemical vapor deposited (PECVD) amorphous silicon (a-Si) film using the bl...

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Bibliographic Details
Main Authors: Hongyuan Xu, Guangmiao Wan, Xu Wang, Xiaoliang Zhou, Jing Liu, Jinming Li, Lei Lu, Shengdong Zhang
Format: Article
Language:English
Published: IEEE 2024-01-01
Series:IEEE Journal of the Electron Devices Society
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Online Access:https://ieeexplore.ieee.org/document/10506233/
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Summary:In this letter, a high performance and large area feasible top-gate low-temperature polysilicon thin film transistor (LTPS TFT) technology is reported. The poly-Si active layer was formed by crystallizing the plasma enhanced chemical vapor deposited (PECVD) amorphous silicon (a-Si) film using the blue laser diode anneal (BLDA) technique. The low resistance of source-drain (S/D) regions were formed from a heavily-doped PECVD a-Si layer. The fabricated top-gate LTPS TFTs exhibit excellent electrical performances, with the carrier mobility more than 556.66 cm2/V-s and on/off-current ratio over <inline-formula> <tex-math notation="LaTeX">$1.58\times 10^{7}$ </tex-math></inline-formula>. This proposed technology is expected to promote the manufacturing lines to the higher generations.
ISSN:2168-6734