Effect of the adhesive added of copper applied with electric current on the ceramic/resin cement bond
The aim of this study was to verify the effect of experimental adhesive added of copper applied with electrical current on the strength, failure type, and contact angle of the ceramic/resin cement bonding. IPS e.max Press ceramic discs included in rigid polyvinyl chloride tubes with chemi...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Academia.edu Journals
2024-07-01
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| Series: | Academia Materials Science |
| Online Access: | https://www.academia.edu/121904053/Effect_of_the_adhesive_added_of_copper_applied_with_electric_current_on_the_ceramic_resin_cement_bond |
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| Summary: | The aim of this study was to verify the effect of experimental adhesive added of copper applied with electrical current on the strength, failure type, and contact angle of the ceramic/resin cement bonding. IPS e.max Press ceramic discs included in rigid polyvinyl chloride tubes with chemically activated acrylic resin were divided into four groups (n = 10): RX + UA (silane + universal adhesive); RX + UA + EC (silane + universal adhesive + electrical current); RX + EA (silane + experimental adhesive); and RX + EA + EC (silane + experimental adhesive + electrical current). After ceramic abrasion with silicon carbide sandpaper, a silane layer was applied for 30 s, waiting for 45 s at room temperature. Afterward, the conventional or experimental adhesive system was applied under 50 µA electrical current for 1 min. Adhesive photoactivation was made with 1,200 mW/cm² irradiance for 20 s. A tube-shaped silicone matrix was placed on the ceramic and filled with photoactivated resin cement. Ceramic/resin cement sets were characterized using microshear (Instron), contact angle (Goniometer), and scanning electron microscopy. The failure pattern was evaluated under optical microscopy at 50× and classified as adhesive, cohesive, or mixed. Microshear strength data were submitted to one-way analysis of variance and Tukey’s test (5%). RX + EA with the highest value differed statistically from RX + UA + EC with the lowest value. RX + UA and RX + EA + EC with similar values were intermediate. Adhesive faiure was predominant in all treatments, and the contact angle was greater when subjected to electrical current. In conclusion, the experimental adhesive added of copper particles promoted a positive effect on adhesive strength only for RX + EA. Adhesive failure was predominant in all treatments, and the contact angle was greater on surfaces subjected to electrical current. |
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| ISSN: | 2997-2027 |