Evaluation of Meshed Reference Planes for High Performance Applications
The actual generations of integrated circuits are characterized, inter alia, by very high frequencies or very high speeds. The dramatic evolution ofthe semiconductor's technology establishes a greater “pressure” to the design and the manufacturing of the passive interconnection structure from P...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Wiley
2000-01-01
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| Series: | Active and Passive Electronic Components |
| Online Access: | http://dx.doi.org/10.1155/2000/35952 |
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| Summary: | The actual generations of integrated circuits are characterized, inter alia, by very high
frequencies or very high speeds. The dramatic evolution ofthe semiconductor's technology
establishes a greater “pressure” to the design and the manufacturing of the passive interconnection
structure from PCB/MCM electronic modules. In these conditions the reference
planes (power and ground planes) have a more and more important contribution. The
paper intents to present the effect of different configuration reference planes on the characteristics
of the high speed/high frequency interconnection lines. The first part deals with
modeling and simulation of usual practical interconnection geometries. A computer modeling
of meshed structures was realized and Spice models for a good compatibility with
circuit simulators were obtained. S-, Y-, Z- parameters and radiation patterns were calculated,
too. The second part contains measurements made by a vector network analyzer
as regards to different practical configurations manufactured at Technical University of
Budapest. |
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| ISSN: | 0882-7516 1563-5031 |