A Back-to-Back Gap Waveguide-Based Packaging Structure for E-Band Radio Frequency Front-End
This paper presents our research on an E-band Radio Frequency (RF) front-end packaging structure based on back-to-back gap waveguide (GW). This design effectively mitigates the impact of air gaps on performance and offers the advantage of large assembly tolerances. Additionally, its back-to-back str...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-05-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2072-666X/16/6/644 |
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