Solid-liquid composite diffusion in Al/Mg bimetallic joints with the Ni/Cu interlayer
Al/Mg bimetallic materials combine the complementary advantages of aluminum and magnesium alloys, demonstrating significant potential for lightweight structural and aerospace applications. However, the formation of brittle intermetallic compounds at the Al/Mg interface during diffusion bonding sever...
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| Main Authors: | Wenbo Wang, Wensheng Liu, Lun Yang, Yunzhu Ma |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-07-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785425016588 |
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