Natural Fiber Incorporated Polymer Matrix Composites for Electronic Circuit Board Applications
There are many more applications for fibre-reinforced epoxy composites than there are for metals and alloys today. For example, sustainable, recyclable, and biodegradable reinforcements have been used in numerous studies to improve the mechanical and thermal properties of composite materials. It was...
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| Format: | Article |
| Language: | English |
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Wiley
2022-01-01
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| Series: | Advances in Materials Science and Engineering |
| Online Access: | http://dx.doi.org/10.1155/2022/3035169 |
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| author | V. S. Chandrika A. Anamika C. Jeeva Bhagavathi Perumal S. Sanal Kumar J. Femila Roseline Ishwarya Komalnu Raghavan |
| author_facet | V. S. Chandrika A. Anamika C. Jeeva Bhagavathi Perumal S. Sanal Kumar J. Femila Roseline Ishwarya Komalnu Raghavan |
| author_sort | V. S. Chandrika |
| collection | DOAJ |
| description | There are many more applications for fibre-reinforced epoxy composites than there are for metals and alloys today. For example, sustainable, recyclable, and biodegradable reinforcements have been used in numerous studies to improve the mechanical and thermal properties of composite materials. It was discovered that the properties of epoxy-based composites could be improved by combining biosolid waste sugarcane bagasse ash fillers, madar fibre, and epoxy resin. Conventional compression molding techniques were used to prepare the sugarcane bagasse ash (SBA) particles and madar fibre-reinforced epoxy resin-based composites (PMCs), which were loaded with varying amounts of fibre and fillers. Hybrid biocomposites were evaluated for mechanical (tensile, flexural, impact, and hardness) and water absorption characteristics. Epoxy matrix composites containing 28 wt.% madar fibre and 7 wt.% sugarcane bagasse ash fillers had tensile, flexural, hardness, and impact values of 61 MPa, 147 MPa, and 54 kJ/m2, respectively. |
| format | Article |
| id | doaj-art-57af4223c1b044adabf5bde5084329d2 |
| institution | OA Journals |
| issn | 1687-8442 |
| language | English |
| publishDate | 2022-01-01 |
| publisher | Wiley |
| record_format | Article |
| series | Advances in Materials Science and Engineering |
| spelling | doaj-art-57af4223c1b044adabf5bde5084329d22025-08-20T02:05:49ZengWileyAdvances in Materials Science and Engineering1687-84422022-01-01202210.1155/2022/3035169Natural Fiber Incorporated Polymer Matrix Composites for Electronic Circuit Board ApplicationsV. S. Chandrika0A. Anamika1C. Jeeva2Bhagavathi Perumal3S. Sanal Kumar4J. Femila Roseline5Ishwarya Komalnu Raghavan6Department of Electrical and Electronics EngineeringDepartment of Electrical and Electronics EngineeringDepartment of Electrical and Electronics EngineeringDepartment of Civil EngineeringDepartment of InstrumentationDepartment of Electronics and Communication EngineeringDepartment of ElectroMechanical EngineeringThere are many more applications for fibre-reinforced epoxy composites than there are for metals and alloys today. For example, sustainable, recyclable, and biodegradable reinforcements have been used in numerous studies to improve the mechanical and thermal properties of composite materials. It was discovered that the properties of epoxy-based composites could be improved by combining biosolid waste sugarcane bagasse ash fillers, madar fibre, and epoxy resin. Conventional compression molding techniques were used to prepare the sugarcane bagasse ash (SBA) particles and madar fibre-reinforced epoxy resin-based composites (PMCs), which were loaded with varying amounts of fibre and fillers. Hybrid biocomposites were evaluated for mechanical (tensile, flexural, impact, and hardness) and water absorption characteristics. Epoxy matrix composites containing 28 wt.% madar fibre and 7 wt.% sugarcane bagasse ash fillers had tensile, flexural, hardness, and impact values of 61 MPa, 147 MPa, and 54 kJ/m2, respectively.http://dx.doi.org/10.1155/2022/3035169 |
| spellingShingle | V. S. Chandrika A. Anamika C. Jeeva Bhagavathi Perumal S. Sanal Kumar J. Femila Roseline Ishwarya Komalnu Raghavan Natural Fiber Incorporated Polymer Matrix Composites for Electronic Circuit Board Applications Advances in Materials Science and Engineering |
| title | Natural Fiber Incorporated Polymer Matrix Composites for Electronic Circuit Board Applications |
| title_full | Natural Fiber Incorporated Polymer Matrix Composites for Electronic Circuit Board Applications |
| title_fullStr | Natural Fiber Incorporated Polymer Matrix Composites for Electronic Circuit Board Applications |
| title_full_unstemmed | Natural Fiber Incorporated Polymer Matrix Composites for Electronic Circuit Board Applications |
| title_short | Natural Fiber Incorporated Polymer Matrix Composites for Electronic Circuit Board Applications |
| title_sort | natural fiber incorporated polymer matrix composites for electronic circuit board applications |
| url | http://dx.doi.org/10.1155/2022/3035169 |
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