Natural Fiber Incorporated Polymer Matrix Composites for Electronic Circuit Board Applications

There are many more applications for fibre-reinforced epoxy composites than there are for metals and alloys today. For example, sustainable, recyclable, and biodegradable reinforcements have been used in numerous studies to improve the mechanical and thermal properties of composite materials. It was...

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Main Authors: V. S. Chandrika, A. Anamika, C. Jeeva, Bhagavathi Perumal, S. Sanal Kumar, J. Femila Roseline, Ishwarya Komalnu Raghavan
Format: Article
Language:English
Published: Wiley 2022-01-01
Series:Advances in Materials Science and Engineering
Online Access:http://dx.doi.org/10.1155/2022/3035169
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author V. S. Chandrika
A. Anamika
C. Jeeva
Bhagavathi Perumal
S. Sanal Kumar
J. Femila Roseline
Ishwarya Komalnu Raghavan
author_facet V. S. Chandrika
A. Anamika
C. Jeeva
Bhagavathi Perumal
S. Sanal Kumar
J. Femila Roseline
Ishwarya Komalnu Raghavan
author_sort V. S. Chandrika
collection DOAJ
description There are many more applications for fibre-reinforced epoxy composites than there are for metals and alloys today. For example, sustainable, recyclable, and biodegradable reinforcements have been used in numerous studies to improve the mechanical and thermal properties of composite materials. It was discovered that the properties of epoxy-based composites could be improved by combining biosolid waste sugarcane bagasse ash fillers, madar fibre, and epoxy resin. Conventional compression molding techniques were used to prepare the sugarcane bagasse ash (SBA) particles and madar fibre-reinforced epoxy resin-based composites (PMCs), which were loaded with varying amounts of fibre and fillers. Hybrid biocomposites were evaluated for mechanical (tensile, flexural, impact, and hardness) and water absorption characteristics. Epoxy matrix composites containing 28 wt.% madar fibre and 7 wt.% sugarcane bagasse ash fillers had tensile, flexural, hardness, and impact values of 61 MPa, 147 MPa, and 54 kJ/m2, respectively.
format Article
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institution OA Journals
issn 1687-8442
language English
publishDate 2022-01-01
publisher Wiley
record_format Article
series Advances in Materials Science and Engineering
spelling doaj-art-57af4223c1b044adabf5bde5084329d22025-08-20T02:05:49ZengWileyAdvances in Materials Science and Engineering1687-84422022-01-01202210.1155/2022/3035169Natural Fiber Incorporated Polymer Matrix Composites for Electronic Circuit Board ApplicationsV. S. Chandrika0A. Anamika1C. Jeeva2Bhagavathi Perumal3S. Sanal Kumar4J. Femila Roseline5Ishwarya Komalnu Raghavan6Department of Electrical and Electronics EngineeringDepartment of Electrical and Electronics EngineeringDepartment of Electrical and Electronics EngineeringDepartment of Civil EngineeringDepartment of InstrumentationDepartment of Electronics and Communication EngineeringDepartment of ElectroMechanical EngineeringThere are many more applications for fibre-reinforced epoxy composites than there are for metals and alloys today. For example, sustainable, recyclable, and biodegradable reinforcements have been used in numerous studies to improve the mechanical and thermal properties of composite materials. It was discovered that the properties of epoxy-based composites could be improved by combining biosolid waste sugarcane bagasse ash fillers, madar fibre, and epoxy resin. Conventional compression molding techniques were used to prepare the sugarcane bagasse ash (SBA) particles and madar fibre-reinforced epoxy resin-based composites (PMCs), which were loaded with varying amounts of fibre and fillers. Hybrid biocomposites were evaluated for mechanical (tensile, flexural, impact, and hardness) and water absorption characteristics. Epoxy matrix composites containing 28 wt.% madar fibre and 7 wt.% sugarcane bagasse ash fillers had tensile, flexural, hardness, and impact values of 61 MPa, 147 MPa, and 54 kJ/m2, respectively.http://dx.doi.org/10.1155/2022/3035169
spellingShingle V. S. Chandrika
A. Anamika
C. Jeeva
Bhagavathi Perumal
S. Sanal Kumar
J. Femila Roseline
Ishwarya Komalnu Raghavan
Natural Fiber Incorporated Polymer Matrix Composites for Electronic Circuit Board Applications
Advances in Materials Science and Engineering
title Natural Fiber Incorporated Polymer Matrix Composites for Electronic Circuit Board Applications
title_full Natural Fiber Incorporated Polymer Matrix Composites for Electronic Circuit Board Applications
title_fullStr Natural Fiber Incorporated Polymer Matrix Composites for Electronic Circuit Board Applications
title_full_unstemmed Natural Fiber Incorporated Polymer Matrix Composites for Electronic Circuit Board Applications
title_short Natural Fiber Incorporated Polymer Matrix Composites for Electronic Circuit Board Applications
title_sort natural fiber incorporated polymer matrix composites for electronic circuit board applications
url http://dx.doi.org/10.1155/2022/3035169
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