Fabrication of SiC@Cu/Cu Composites with the Addition of SiC@Cu Powder by Magnetron Sputtering
In view of the surface engineering application of electrical contact materials, SiC ceramic particles were introduced into copper matrix composites by the hot-press sintering method for the sake of enhancing the service life of copper matrix electrical contact materials. Magnetron sputtering technol...
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Main Authors: | Zhang Yunlong, Li Wenbo, Hu Ming, Yi Hongyong, Zhou Wei, Ding Peiling, Tang Lili |
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Format: | Article |
Language: | English |
Published: |
Wiley
2021-01-01
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Series: | International Journal of Photoenergy |
Online Access: | http://dx.doi.org/10.1155/2021/6623776 |
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