Temperature-Insensitive Cryogenic Packaging for Thin-Film Lithium Niobate Photonic Chips

Temperature-Insensitive Cryogenic Packaging for Thin-Film Lithium Niobate Photonic Chips

As photonic integrated circuits (PICs) gain prominence in quantum communication and quantum computation, the development of efficient and stable cryogenic packaging technologies becomes paramount. This paper presents a robust and scalable cryogenic packaging method for thin-film lithium niobate (TFL...

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Bibliographic Details
Main Authors: Yongteng Wang, Yuxin Ma, Xiaojie Wang, Ziwei Zhao, Yongmin Li, Tianshu Yang
Format: Article
Language:English
Published: MDPI AG 2025-05-01
Series:Photonics
Subjects:
lithium niobate
cryogenic packaging
optical coupling
Online Access:https://www.mdpi.com/2304-6732/12/6/545
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