Application of Diverse Testing to Improve Integrated Circuit Test Yield and Quality
This paper utilizes the digital integrated circuit testing model to compute the test yield curve of future wafers and explore the influence of test guardband (TGB) on quality and yield. With the passage of three years since the COVID-19 pandemic disrupted semiconductor production lines, the semicond...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2024-12-01
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| Series: | Eng |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2673-4117/5/4/183 |
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