Through-silicon-via formation of 3D electronic modules by laser radiation

Through-silicon-via formation of 3D electronic modules by laser radiation

Laser  heating  is  a  promising  method  for  through-silicon-via  (TSV)  formation  in  assembling  highdensity 3D electronic modules due to its high specific energy and local heating ability. Using laser radiation for the formation of TSV makes it possible to reduce its diameter, indirectly incre...

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Bibliographic Details
Main Authors: V. L. Lanin, V. T Pham, A. I. Lappo
Format: Article
Language:Russian
Published: Educational institution «Belarusian State University of Informatics and Radioelectronics» 2021-06-01
Series:Doklady Belorusskogo gosudarstvennogo universiteta informatiki i radioèlektroniki
Subjects:
laser radiation
silicon substrate
hole taper coefficient
thermal field simulation
initial temperature
Online Access:https://doklady.bsuir.by/jour/article/view/3078
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