Single-particle-thick microstructures fabricated through controlled withdrawal of particles from a dispersion meniscus
Beaded chains of conductive microparticles formed in air represent one of the most intriguing classes of particle-based microstructures. These 1D particle crystals offer high added value due to their unique physical properties. However, their fabrication remains challenging, and no scalable or indus...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-07-01
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| Series: | Materials & Design |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S0264127525005805 |
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| Summary: | Beaded chains of conductive microparticles formed in air represent one of the most intriguing classes of particle-based microstructures. These 1D particle crystals offer high added value due to their unique physical properties. However, their fabrication remains challenging, and no scalable or industrially viable methods currently exist. This work presents a straightforward approach for forming such structures. The process utilizes a dispersion meniscus formed at the outlet of a conduit that also serves as an electrode. Microparticles are electrically extracted from the meniscus to form a single-particle-thick assembly with controllable length. The physical mechanisms governing structure formation are examined, and key sources of instability are identified to support process optimization. The effects of particle size, density, dispersing liquid viscosity, voltage magnitude, substrate geometry and conductivity, extraction direction, and pulling velocity are systematically investigated. The knowledge obtained through our basic research enables the reliable fabrication of freestanding particle structures and serves as a direct foundation for applied studies. To illustrate the practical potential of the method, several application-oriented demonstrations are presented. The impact of the work spans multiple fields, including materials science, soft matter physics, and microfabrication, and opens pathways for industrial applications in electronics, soft robotics, and additive manufacturing. |
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| ISSN: | 0264-1275 |