Thermomigration Microstructure and Properties of Ni Nanoparticle-Reinforced Sn58Bi Composite Solder/Cu Solder Joint
A Sn58Bi composite solder reinforced by Ni nanoparticles was prepared using a mechanical mixing technique, and the thermomigration microstructure and properties of the solder joints were studied. The findings indicate that incorporating an appropriate quantity of Ni nanoparticles can enhance the mic...
Saved in:
| Main Authors: | , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2024-12-01
|
| Series: | Metals |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2075-4701/14/12/1420 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|