Thermomigration Microstructure and Properties of Ni Nanoparticle-Reinforced Sn58Bi Composite Solder/Cu Solder Joint
A Sn58Bi composite solder reinforced by Ni nanoparticles was prepared using a mechanical mixing technique, and the thermomigration microstructure and properties of the solder joints were studied. The findings indicate that incorporating an appropriate quantity of Ni nanoparticles can enhance the mic...
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MDPI AG
2024-12-01
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| Online Access: | https://www.mdpi.com/2075-4701/14/12/1420 |
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| author | Yuchun Fan Keke Zhang Weiming Chen Jinna Wu Yonglei Wang |
| author_facet | Yuchun Fan Keke Zhang Weiming Chen Jinna Wu Yonglei Wang |
| author_sort | Yuchun Fan |
| collection | DOAJ |
| description | A Sn58Bi composite solder reinforced by Ni nanoparticles was prepared using a mechanical mixing technique, and the thermomigration microstructure and properties of the solder joints were studied. The findings indicate that incorporating an appropriate quantity of Ni nanoparticles can enhance the microstructure of the composite solder and mitigate the coarsening of Bi-phase segregation. At 0.75 weight percent Ni nanoparticle content, the composite solder’s tensile strength is 59.7 MPa and its elongation is 54.6%, both of which are noticeably greater than those of the base solder. When the thermal loading time is 576 h, the shear strength of the composite solder joint is 25.5 MPa, which is 30.1% higher than that of the base solder joint. This study reveals that the shear fracture path shifts from the boundary region between the solder seam and the IMC layer to the IMC layer itself. Concurrently, the fracture mode evolves from a mix of brittle–ductile fracture, characterized by quasi-cleavage, to a predominantly brittle fracture, marked by numerous “rock candy-like” cross-sectional features and secondary cracking. Adding Ni nanoparticles to the Sn58Bi composite solder/Cu solder junction can significantly extend its service life. |
| format | Article |
| id | doaj-art-4e0ed294dd424779a1a27548edc0c701 |
| institution | DOAJ |
| issn | 2075-4701 |
| language | English |
| publishDate | 2024-12-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Metals |
| spelling | doaj-art-4e0ed294dd424779a1a27548edc0c7012025-08-20T02:56:50ZengMDPI AGMetals2075-47012024-12-011412142010.3390/met14121420Thermomigration Microstructure and Properties of Ni Nanoparticle-Reinforced Sn58Bi Composite Solder/Cu Solder JointYuchun Fan0Keke Zhang1Weiming Chen2Jinna Wu3Yonglei Wang4School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471023, ChinaSchool of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471023, ChinaSchool of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471023, ChinaSchool of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471023, ChinaSchool of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471023, ChinaA Sn58Bi composite solder reinforced by Ni nanoparticles was prepared using a mechanical mixing technique, and the thermomigration microstructure and properties of the solder joints were studied. The findings indicate that incorporating an appropriate quantity of Ni nanoparticles can enhance the microstructure of the composite solder and mitigate the coarsening of Bi-phase segregation. At 0.75 weight percent Ni nanoparticle content, the composite solder’s tensile strength is 59.7 MPa and its elongation is 54.6%, both of which are noticeably greater than those of the base solder. When the thermal loading time is 576 h, the shear strength of the composite solder joint is 25.5 MPa, which is 30.1% higher than that of the base solder joint. This study reveals that the shear fracture path shifts from the boundary region between the solder seam and the IMC layer to the IMC layer itself. Concurrently, the fracture mode evolves from a mix of brittle–ductile fracture, characterized by quasi-cleavage, to a predominantly brittle fracture, marked by numerous “rock candy-like” cross-sectional features and secondary cracking. Adding Ni nanoparticles to the Sn58Bi composite solder/Cu solder junction can significantly extend its service life.https://www.mdpi.com/2075-4701/14/12/1420Ni nanoparticlesSn58Bi composite solderlead-free solder jointthermomigrationmicrostructureproperty |
| spellingShingle | Yuchun Fan Keke Zhang Weiming Chen Jinna Wu Yonglei Wang Thermomigration Microstructure and Properties of Ni Nanoparticle-Reinforced Sn58Bi Composite Solder/Cu Solder Joint Metals Ni nanoparticles Sn58Bi composite solder lead-free solder joint thermomigration microstructure property |
| title | Thermomigration Microstructure and Properties of Ni Nanoparticle-Reinforced Sn58Bi Composite Solder/Cu Solder Joint |
| title_full | Thermomigration Microstructure and Properties of Ni Nanoparticle-Reinforced Sn58Bi Composite Solder/Cu Solder Joint |
| title_fullStr | Thermomigration Microstructure and Properties of Ni Nanoparticle-Reinforced Sn58Bi Composite Solder/Cu Solder Joint |
| title_full_unstemmed | Thermomigration Microstructure and Properties of Ni Nanoparticle-Reinforced Sn58Bi Composite Solder/Cu Solder Joint |
| title_short | Thermomigration Microstructure and Properties of Ni Nanoparticle-Reinforced Sn58Bi Composite Solder/Cu Solder Joint |
| title_sort | thermomigration microstructure and properties of ni nanoparticle reinforced sn58bi composite solder cu solder joint |
| topic | Ni nanoparticles Sn58Bi composite solder lead-free solder joint thermomigration microstructure property |
| url | https://www.mdpi.com/2075-4701/14/12/1420 |
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