Physics-informed and data-driven thermal modeling and temperature field prediction for thermal field-assisted direct ink writing with PDMS

Thermal field assistance enables in situ heating, improving the curing kinetics and printability of thermosetting polymers. However, it alters the temperature distribution during forming, affecting printing quality. Accurate temperature field prediction is essential for process optimization. Althoug...

Full description

Saved in:
Bibliographic Details
Main Authors: Xinhua Yao, Yuhan Jiang, Lixin Tian, Xiang Li, Yong He
Format: Article
Language:English
Published: Elsevier 2025-08-01
Series:Materials & Design
Subjects:
Online Access:http://www.sciencedirect.com/science/article/pii/S026412752500704X
Tags: Add Tag
No Tags, Be the first to tag this record!
_version_ 1849472652793610240
author Xinhua Yao
Yuhan Jiang
Lixin Tian
Xiang Li
Yong He
author_facet Xinhua Yao
Yuhan Jiang
Lixin Tian
Xiang Li
Yong He
author_sort Xinhua Yao
collection DOAJ
description Thermal field assistance enables in situ heating, improving the curing kinetics and printability of thermosetting polymers. However, it alters the temperature distribution during forming, affecting printing quality. Accurate temperature field prediction is essential for process optimization. Although numerical simulations can capture temperature evolution in additive manufacturing (AM), they are time-consuming and storage-intensive, limiting their efficiency for real-time applications. To address this limitation, developing a rapid temperature prediction surrogate model based on deep learning becomes essential. In this study, a thermal simulation framework was developed specifically for thermal field-assisted AM (TFAM). Based on this framework, a surrogate model integrating physics-based and data-driven approaches was constructed and trained using multi-condition simulation datasets. To validate the simulation accuracy and evaluate the surrogate model, an experimental platform for thermosetting polymers was also established. The results showed that the average relative error between simulation and experiments was below 3 %. The proposed surrogate model outperformed other data-driven methods, achieving an average R2 above 0.99, with maximum RMSE and MAE of 0.3314 °C and 0.3174 °C. Notably, it maintained RMSE below 1 °C with only 10 % of the training data. Additionally, it reduced prediction time to seconds and storage to megabytes, significantly exceeding the efficiency of traditional simulations.
format Article
id doaj-art-4cfb014fb36a49eab5a452e8c6af757a
institution Kabale University
issn 0264-1275
language English
publishDate 2025-08-01
publisher Elsevier
record_format Article
series Materials & Design
spelling doaj-art-4cfb014fb36a49eab5a452e8c6af757a2025-08-20T03:24:29ZengElsevierMaterials & Design0264-12752025-08-0125611428410.1016/j.matdes.2025.114284Physics-informed and data-driven thermal modeling and temperature field prediction for thermal field-assisted direct ink writing with PDMSXinhua Yao0Yuhan Jiang1Lixin Tian2Xiang Li3Yong He4The State Key Laboratory of Fluid Power and Mechatronic Systems, College of Mechanical Engineering, Zhejiang University, Hangzhou 310027, China; Key Laboratory of 3D Printing Process and Equipment of Zhejiang Province, College of Mechanical Engineering, Zhejiang University, Hangzhou 310027, China; Corresponding author at: The State Key Laboratory of Fluid Power and Mechatronic Systems, College of Mechanical Engineering, Zhejiang University, Hangzhou 310027, China.The State Key Laboratory of Fluid Power and Mechatronic Systems, College of Mechanical Engineering, Zhejiang University, Hangzhou 310027, China; Key Laboratory of 3D Printing Process and Equipment of Zhejiang Province, College of Mechanical Engineering, Zhejiang University, Hangzhou 310027, ChinaThe State Key Laboratory of Fluid Power and Mechatronic Systems, College of Mechanical Engineering, Zhejiang University, Hangzhou 310027, China; Key Laboratory of 3D Printing Process and Equipment of Zhejiang Province, College of Mechanical Engineering, Zhejiang University, Hangzhou 310027, ChinaThe State Key Laboratory of Fluid Power and Mechatronic Systems, College of Mechanical Engineering, Zhejiang University, Hangzhou 310027, China; Key Laboratory of 3D Printing Process and Equipment of Zhejiang Province, College of Mechanical Engineering, Zhejiang University, Hangzhou 310027, ChinaThe State Key Laboratory of Fluid Power and Mechatronic Systems, College of Mechanical Engineering, Zhejiang University, Hangzhou 310027, China; Key Laboratory of 3D Printing Process and Equipment of Zhejiang Province, College of Mechanical Engineering, Zhejiang University, Hangzhou 310027, ChinaThermal field assistance enables in situ heating, improving the curing kinetics and printability of thermosetting polymers. However, it alters the temperature distribution during forming, affecting printing quality. Accurate temperature field prediction is essential for process optimization. Although numerical simulations can capture temperature evolution in additive manufacturing (AM), they are time-consuming and storage-intensive, limiting their efficiency for real-time applications. To address this limitation, developing a rapid temperature prediction surrogate model based on deep learning becomes essential. In this study, a thermal simulation framework was developed specifically for thermal field-assisted AM (TFAM). Based on this framework, a surrogate model integrating physics-based and data-driven approaches was constructed and trained using multi-condition simulation datasets. To validate the simulation accuracy and evaluate the surrogate model, an experimental platform for thermosetting polymers was also established. The results showed that the average relative error between simulation and experiments was below 3 %. The proposed surrogate model outperformed other data-driven methods, achieving an average R2 above 0.99, with maximum RMSE and MAE of 0.3314 °C and 0.3174 °C. Notably, it maintained RMSE below 1 °C with only 10 % of the training data. Additionally, it reduced prediction time to seconds and storage to megabytes, significantly exceeding the efficiency of traditional simulations.http://www.sciencedirect.com/science/article/pii/S026412752500704XThermal field-assisted additive manufacturingThermal modelingTemperature field predictionData-drivenPhysical information
spellingShingle Xinhua Yao
Yuhan Jiang
Lixin Tian
Xiang Li
Yong He
Physics-informed and data-driven thermal modeling and temperature field prediction for thermal field-assisted direct ink writing with PDMS
Materials & Design
Thermal field-assisted additive manufacturing
Thermal modeling
Temperature field prediction
Data-driven
Physical information
title Physics-informed and data-driven thermal modeling and temperature field prediction for thermal field-assisted direct ink writing with PDMS
title_full Physics-informed and data-driven thermal modeling and temperature field prediction for thermal field-assisted direct ink writing with PDMS
title_fullStr Physics-informed and data-driven thermal modeling and temperature field prediction for thermal field-assisted direct ink writing with PDMS
title_full_unstemmed Physics-informed and data-driven thermal modeling and temperature field prediction for thermal field-assisted direct ink writing with PDMS
title_short Physics-informed and data-driven thermal modeling and temperature field prediction for thermal field-assisted direct ink writing with PDMS
title_sort physics informed and data driven thermal modeling and temperature field prediction for thermal field assisted direct ink writing with pdms
topic Thermal field-assisted additive manufacturing
Thermal modeling
Temperature field prediction
Data-driven
Physical information
url http://www.sciencedirect.com/science/article/pii/S026412752500704X
work_keys_str_mv AT xinhuayao physicsinformedanddatadriventhermalmodelingandtemperaturefieldpredictionforthermalfieldassisteddirectinkwritingwithpdms
AT yuhanjiang physicsinformedanddatadriventhermalmodelingandtemperaturefieldpredictionforthermalfieldassisteddirectinkwritingwithpdms
AT lixintian physicsinformedanddatadriventhermalmodelingandtemperaturefieldpredictionforthermalfieldassisteddirectinkwritingwithpdms
AT xiangli physicsinformedanddatadriventhermalmodelingandtemperaturefieldpredictionforthermalfieldassisteddirectinkwritingwithpdms
AT yonghe physicsinformedanddatadriventhermalmodelingandtemperaturefieldpredictionforthermalfieldassisteddirectinkwritingwithpdms