An Online Monitoring Method for Bond Wire Fatigue in IGBT Module
IGBT modules are core components of power electronic converters, and their reliability has gained significant attention. Among various reliability concerns, bond wire fatigue is a prominent issue. Bond wire fatigue can alter the electrical characteristics of IGBT modules, affecting the turn-off proc...
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| Format: | Article |
| Language: | English |
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IEEE
2024-01-01
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| Series: | IEEE Journal of the Electron Devices Society |
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| Online Access: | https://ieeexplore.ieee.org/document/10529136/ |
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| author | Hongtao Liu Fei Wang Xiaokang Zhang Weiyi Xia Lintao Ren |
| author_facet | Hongtao Liu Fei Wang Xiaokang Zhang Weiyi Xia Lintao Ren |
| author_sort | Hongtao Liu |
| collection | DOAJ |
| description | IGBT modules are core components of power electronic converters, and their reliability has gained significant attention. Among various reliability concerns, bond wire fatigue is a prominent issue. Bond wire fatigue can alter the electrical characteristics of IGBT modules, affecting the turn-off process of the IGBT. Consequently, it leads to changes in the collector-emitter voltage spike and the auxiliary emitter-emitter voltage spike during the turn-off process. The paper proposes the utilization of the K factor parameter which is not affected by the collector current and junction temperature, based on the collector-emitter voltage spike and the auxiliary emitter-emitter voltage spike, for bond wire fatigue monitoring of IGBT modules. Additionally, the monitoring of bond wire fatigue and junction temperature of IGBT modules was achieved based on the K factor parameter and the auxiliary emitter-emitter voltage spike. This provides a basis for the reliability assessment of IGBT modules. |
| format | Article |
| id | doaj-art-4cac9cc14c784c34907d88319612e6ce |
| institution | Kabale University |
| issn | 2168-6734 |
| language | English |
| publishDate | 2024-01-01 |
| publisher | IEEE |
| record_format | Article |
| series | IEEE Journal of the Electron Devices Society |
| spelling | doaj-art-4cac9cc14c784c34907d88319612e6ce2025-01-28T00:00:40ZengIEEEIEEE Journal of the Electron Devices Society2168-67342024-01-011244044910.1109/JEDS.2024.339955410529136An Online Monitoring Method for Bond Wire Fatigue in IGBT ModuleHongtao Liu0https://orcid.org/0000-0002-8053-0057Fei Wang1https://orcid.org/0000-0001-6567-0265Xiaokang Zhang2https://orcid.org/0000-0002-4730-746XWeiyi Xia3Lintao Ren4School of Mechatronics Engineering and Automation, Shanghai University, Shanghai, ChinaSchool of Mechatronics Engineering and Automation, Shanghai University, Shanghai, ChinaSchool of Mechatronics Engineering and Automation, Shanghai University, Shanghai, ChinaSchool of Mechatronics Engineering and Automation, Shanghai University, Shanghai, ChinaSchool of Mechatronics Engineering and Automation, Shanghai University, Shanghai, ChinaIGBT modules are core components of power electronic converters, and their reliability has gained significant attention. Among various reliability concerns, bond wire fatigue is a prominent issue. Bond wire fatigue can alter the electrical characteristics of IGBT modules, affecting the turn-off process of the IGBT. Consequently, it leads to changes in the collector-emitter voltage spike and the auxiliary emitter-emitter voltage spike during the turn-off process. The paper proposes the utilization of the K factor parameter which is not affected by the collector current and junction temperature, based on the collector-emitter voltage spike and the auxiliary emitter-emitter voltage spike, for bond wire fatigue monitoring of IGBT modules. Additionally, the monitoring of bond wire fatigue and junction temperature of IGBT modules was achieved based on the K factor parameter and the auxiliary emitter-emitter voltage spike. This provides a basis for the reliability assessment of IGBT modules.https://ieeexplore.ieee.org/document/10529136/IGBT modulebond wire fatigueK factorjunction temperature extraction |
| spellingShingle | Hongtao Liu Fei Wang Xiaokang Zhang Weiyi Xia Lintao Ren An Online Monitoring Method for Bond Wire Fatigue in IGBT Module IEEE Journal of the Electron Devices Society IGBT module bond wire fatigue K factor junction temperature extraction |
| title | An Online Monitoring Method for Bond Wire Fatigue in IGBT Module |
| title_full | An Online Monitoring Method for Bond Wire Fatigue in IGBT Module |
| title_fullStr | An Online Monitoring Method for Bond Wire Fatigue in IGBT Module |
| title_full_unstemmed | An Online Monitoring Method for Bond Wire Fatigue in IGBT Module |
| title_short | An Online Monitoring Method for Bond Wire Fatigue in IGBT Module |
| title_sort | online monitoring method for bond wire fatigue in igbt module |
| topic | IGBT module bond wire fatigue K factor junction temperature extraction |
| url | https://ieeexplore.ieee.org/document/10529136/ |
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