High strength and high conductivity pure copper prepared by ECAP-Conform combined with cryogenic rolling and recrystallization annealing
The large-scale production of high-strength and high-conductivity pure copper holds significant importance for electronic information and transportation fields. This study innovatively proposes a composite thermomechanical processing route of “ECAP-C + cryogenic rolling + recrystallization annealing...
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| Format: | Article |
| Language: | English |
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Elsevier
2025-05-01
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| Series: | Journal of Materials Research and Technology |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785425008427 |
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| _version_ | 1850186100595752960 |
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| author | Yuehong Zheng Jianan Niu Ying Lu Shipeng Xu Zhumin Li He Zhao Peiqing La |
| author_facet | Yuehong Zheng Jianan Niu Ying Lu Shipeng Xu Zhumin Li He Zhao Peiqing La |
| author_sort | Yuehong Zheng |
| collection | DOAJ |
| description | The large-scale production of high-strength and high-conductivity pure copper holds significant importance for electronic information and transportation fields. This study innovatively proposes a composite thermomechanical processing route of “ECAP-C + cryogenic rolling + recrystallization annealing”, aiming to significantly improve material strength while maintaining excellent electrical conductivity. The research demonstrates that through precise regulation of grain size and internal defects (primarily dislocations), pure copper achieves both high electrical conductivity (91.9 %IACS) and remarkably enhanced tensile strength (506.38 MPa) with elongation (9.8 %). Microstructural characterization reveals refined average grain size (0.85 μm) and optimized dislocation density (1.07 × 1015 m−2), which exhibit weaker electron scattering compared to solute atoms while substantially improving grain refinement strengthening and dislocation strengthening effects. This study applies the material simplification concept and non-alloying strengthening strategies to develop high-performance pure copper, proposing a scalable composite processing technology that conserves resources. It provides novel strategies and perspectives for developing other high-strength, high-conductivity materials. |
| format | Article |
| id | doaj-art-481cf6a3cce74bb4b96b1a19b0ec9493 |
| institution | OA Journals |
| issn | 2238-7854 |
| language | English |
| publishDate | 2025-05-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj-art-481cf6a3cce74bb4b96b1a19b0ec94932025-08-20T02:16:29ZengElsevierJournal of Materials Research and Technology2238-78542025-05-01363192320410.1016/j.jmrt.2025.04.020High strength and high conductivity pure copper prepared by ECAP-Conform combined with cryogenic rolling and recrystallization annealingYuehong Zheng0Jianan Niu1Ying Lu2Shipeng Xu3Zhumin Li4He Zhao5Peiqing La6State Key Laboratory of Advanced Processing and Recycling of Nonferrous Metal, Lanzhou University of Technology, Lanzhou, 730050, China; Corresponding author.State Key Laboratory of Advanced Processing and Recycling of Nonferrous Metal, Lanzhou University of Technology, Lanzhou, 730050, ChinaState Key Laboratory of Advanced Processing and Recycling of Nonferrous Metal, Lanzhou University of Technology, Lanzhou, 730050, ChinaKey Laboratory of Solar Power System, Gansu Jiuquan Vocational and Technical College, Jiuquan, 735000, ChinaSchool of Materials Science and Engineering, Anhui Polytechnic University, Wuhu, 241000, ChinaState Key Laboratory of Advanced Processing and Recycling of Nonferrous Metal, Lanzhou University of Technology, Lanzhou, 730050, ChinaState Key Laboratory of Advanced Processing and Recycling of Nonferrous Metal, Lanzhou University of Technology, Lanzhou, 730050, China; Corresponding author.The large-scale production of high-strength and high-conductivity pure copper holds significant importance for electronic information and transportation fields. This study innovatively proposes a composite thermomechanical processing route of “ECAP-C + cryogenic rolling + recrystallization annealing”, aiming to significantly improve material strength while maintaining excellent electrical conductivity. The research demonstrates that through precise regulation of grain size and internal defects (primarily dislocations), pure copper achieves both high electrical conductivity (91.9 %IACS) and remarkably enhanced tensile strength (506.38 MPa) with elongation (9.8 %). Microstructural characterization reveals refined average grain size (0.85 μm) and optimized dislocation density (1.07 × 1015 m−2), which exhibit weaker electron scattering compared to solute atoms while substantially improving grain refinement strengthening and dislocation strengthening effects. This study applies the material simplification concept and non-alloying strengthening strategies to develop high-performance pure copper, proposing a scalable composite processing technology that conserves resources. It provides novel strategies and perspectives for developing other high-strength, high-conductivity materials.http://www.sciencedirect.com/science/article/pii/S2238785425008427Pure copperECAP-ConformCryogenic rollingTensile strengthElectrical conductivity |
| spellingShingle | Yuehong Zheng Jianan Niu Ying Lu Shipeng Xu Zhumin Li He Zhao Peiqing La High strength and high conductivity pure copper prepared by ECAP-Conform combined with cryogenic rolling and recrystallization annealing Journal of Materials Research and Technology Pure copper ECAP-Conform Cryogenic rolling Tensile strength Electrical conductivity |
| title | High strength and high conductivity pure copper prepared by ECAP-Conform combined with cryogenic rolling and recrystallization annealing |
| title_full | High strength and high conductivity pure copper prepared by ECAP-Conform combined with cryogenic rolling and recrystallization annealing |
| title_fullStr | High strength and high conductivity pure copper prepared by ECAP-Conform combined with cryogenic rolling and recrystallization annealing |
| title_full_unstemmed | High strength and high conductivity pure copper prepared by ECAP-Conform combined with cryogenic rolling and recrystallization annealing |
| title_short | High strength and high conductivity pure copper prepared by ECAP-Conform combined with cryogenic rolling and recrystallization annealing |
| title_sort | high strength and high conductivity pure copper prepared by ecap conform combined with cryogenic rolling and recrystallization annealing |
| topic | Pure copper ECAP-Conform Cryogenic rolling Tensile strength Electrical conductivity |
| url | http://www.sciencedirect.com/science/article/pii/S2238785425008427 |
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