The synchronous improvement of thermal stability, mechanical properties, thermal conductivity of oxide dispersion strengthened Cu–Cr alloy by microalloying Si
In this work, mechanical alloying combined with spark plasma sintering (SPS) processes were used to prepare Cu-0.65Cr-0.5Y-0.15Cu2O, Cu-0.65Cr-0.5Y-0.5Al-0.15Cu2O and Cu-0.65Cr-0.5Y-0.5Si-0.15Cu2O (wt%). The effects of the introduction of Al or Si on the microstructure, mechanical properties, therma...
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2025-01-01
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| author | Yaju Zhou Shengming Yin Qian Lei Jianglei Fan Shizhong Wei Youwei Yan |
| author_facet | Yaju Zhou Shengming Yin Qian Lei Jianglei Fan Shizhong Wei Youwei Yan |
| author_sort | Yaju Zhou |
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| description | In this work, mechanical alloying combined with spark plasma sintering (SPS) processes were used to prepare Cu-0.65Cr-0.5Y-0.15Cu2O, Cu-0.65Cr-0.5Y-0.5Al-0.15Cu2O and Cu-0.65Cr-0.5Y-0.5Si-0.15Cu2O (wt%). The effects of the introduction of Al or Si on the microstructure, mechanical properties, thermal conductivity and thermal stability of ODS Cu alloy were studied. All three alloys exhibit heterogeneous mixed grain structures, including coarse and fine grains, with oxide nanoparticles uniformly distributed throughout the copper matrix. However, the addition of Al or Si leads to grain refinement and further refinement of the oxide nanoparticles. Compared with ODS Cu alloy, the ultimate tensile strength of ODS Cu–Cr–Si alloy increased from 554 MPa to 621 MPa, the elongation at break increased from 8.8% to 11%, and the thermal conductivity increased from 221.5 W m−1 K−1 to 262.3 W m−1 K−1, respectively. The ODS Cu–Cr–Si alloy also shows ultrahigh microstructural stability upon annealing at 600 °C for 50 h. The excellent strength, ductility and thermal conductivity comes mainly from the high-density coherent nano-Y2Si2O7 (<15 nm) dispersed in ultrafine grain Cu matrix. In addition, it is found that the microalloying Si and Al significantly improve the MA efficiency. These findings indicate that an ODS Cu alloy promising for application under high-temperature (HT) conditions can be produced effectively and efficiently by combining composition design and process optimization. |
| format | Article |
| id | doaj-art-47a9171b489e421d806265c16642ab05 |
| institution | Kabale University |
| issn | 2238-7854 |
| language | English |
| publishDate | 2025-01-01 |
| publisher | Elsevier |
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| series | Journal of Materials Research and Technology |
| spelling | doaj-art-47a9171b489e421d806265c16642ab052025-01-19T06:25:50ZengElsevierJournal of Materials Research and Technology2238-78542025-01-013421612173The synchronous improvement of thermal stability, mechanical properties, thermal conductivity of oxide dispersion strengthened Cu–Cr alloy by microalloying SiYaju Zhou0Shengming Yin1Qian Lei2Jianglei Fan3Shizhong Wei4Youwei Yan5Institute of Mechanical and Electrical Engineering, Henan Key Laboratory of Intelligent Manufacturing of Mechanical Equipment, Zhengzhou University of Light Industry, Zhengzhou, China; Corresponding author.State Key Laboratory of Materials Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074, China; Corresponding author.State Key Laboratory for Powder Metallurgy, Central South University, Changsha, 410083, ChinaInstitute of Mechanical and Electrical Engineering, Henan Key Laboratory of Intelligent Manufacturing of Mechanical Equipment, Zhengzhou University of Light Industry, Zhengzhou, ChinaInstitute of Mechanical and Electrical Engineering, Henan Key Laboratory of Intelligent Manufacturing of Mechanical Equipment, Zhengzhou University of Light Industry, Zhengzhou, ChinaState Key Laboratory of Materials Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074, China; School of Aerospace Engineering, Huazhong University of Science and Technology, Wuhan, 430074, ChinaIn this work, mechanical alloying combined with spark plasma sintering (SPS) processes were used to prepare Cu-0.65Cr-0.5Y-0.15Cu2O, Cu-0.65Cr-0.5Y-0.5Al-0.15Cu2O and Cu-0.65Cr-0.5Y-0.5Si-0.15Cu2O (wt%). The effects of the introduction of Al or Si on the microstructure, mechanical properties, thermal conductivity and thermal stability of ODS Cu alloy were studied. All three alloys exhibit heterogeneous mixed grain structures, including coarse and fine grains, with oxide nanoparticles uniformly distributed throughout the copper matrix. However, the addition of Al or Si leads to grain refinement and further refinement of the oxide nanoparticles. Compared with ODS Cu alloy, the ultimate tensile strength of ODS Cu–Cr–Si alloy increased from 554 MPa to 621 MPa, the elongation at break increased from 8.8% to 11%, and the thermal conductivity increased from 221.5 W m−1 K−1 to 262.3 W m−1 K−1, respectively. The ODS Cu–Cr–Si alloy also shows ultrahigh microstructural stability upon annealing at 600 °C for 50 h. The excellent strength, ductility and thermal conductivity comes mainly from the high-density coherent nano-Y2Si2O7 (<15 nm) dispersed in ultrafine grain Cu matrix. In addition, it is found that the microalloying Si and Al significantly improve the MA efficiency. These findings indicate that an ODS Cu alloy promising for application under high-temperature (HT) conditions can be produced effectively and efficiently by combining composition design and process optimization.http://www.sciencedirect.com/science/article/pii/S2238785424030151Oxide dispersion strengthenedCu alloysMicrostructureMechanical and thermal propertiesHigh-temperature stability |
| spellingShingle | Yaju Zhou Shengming Yin Qian Lei Jianglei Fan Shizhong Wei Youwei Yan The synchronous improvement of thermal stability, mechanical properties, thermal conductivity of oxide dispersion strengthened Cu–Cr alloy by microalloying Si Journal of Materials Research and Technology Oxide dispersion strengthened Cu alloys Microstructure Mechanical and thermal properties High-temperature stability |
| title | The synchronous improvement of thermal stability, mechanical properties, thermal conductivity of oxide dispersion strengthened Cu–Cr alloy by microalloying Si |
| title_full | The synchronous improvement of thermal stability, mechanical properties, thermal conductivity of oxide dispersion strengthened Cu–Cr alloy by microalloying Si |
| title_fullStr | The synchronous improvement of thermal stability, mechanical properties, thermal conductivity of oxide dispersion strengthened Cu–Cr alloy by microalloying Si |
| title_full_unstemmed | The synchronous improvement of thermal stability, mechanical properties, thermal conductivity of oxide dispersion strengthened Cu–Cr alloy by microalloying Si |
| title_short | The synchronous improvement of thermal stability, mechanical properties, thermal conductivity of oxide dispersion strengthened Cu–Cr alloy by microalloying Si |
| title_sort | synchronous improvement of thermal stability mechanical properties thermal conductivity of oxide dispersion strengthened cu cr alloy by microalloying si |
| topic | Oxide dispersion strengthened Cu alloys Microstructure Mechanical and thermal properties High-temperature stability |
| url | http://www.sciencedirect.com/science/article/pii/S2238785424030151 |
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