Intragranular strain and mosaicity in Cu thin films during fast thermomechanical fatigue
Abstract Modern high-power semiconductor devices in automotive applications are subjected to overload pulses with heating rates up to 106 K ∙ s−1, causing temperature spikes of up to 300 °C. Cu thin films in these devices function not only as electrical conductors but also as primary heat sinks, fac...
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| Main Authors: | , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Nature Portfolio
2025-07-01
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| Series: | npj Materials Degradation |
| Online Access: | https://doi.org/10.1038/s41529-025-00629-z |
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