Thermal exposure induced microstructural changes and associated creep property enhancement of a PM near-α Ti–6Al–2Sn–4Zr–2Mo–0.5Y–0.5Si alloy
This study investigates the effects of thermal exposure on the microstructure and creep behavior of a powder metallurgy near-α Ti–6Al–2Sn–4Zr–2Mo–0.5Y–0.5Si alloy. Thermal exposure at 600 °C for 200 h induces multiple microstructural changes, including fragmentation and partial dissolution of β laye...
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| Language: | English |
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Elsevier
2025-09-01
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| Series: | Journal of Materials Research and Technology |
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| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785425019337 |
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| author | Xuemei Yu Fuyang Yu Yan Wu Xiuzhen Zhang Xiaogang Wu Bowen Zhang Hongzhi Niu Deliang Zhang |
| author_facet | Xuemei Yu Fuyang Yu Yan Wu Xiuzhen Zhang Xiaogang Wu Bowen Zhang Hongzhi Niu Deliang Zhang |
| author_sort | Xuemei Yu |
| collection | DOAJ |
| description | This study investigates the effects of thermal exposure on the microstructure and creep behavior of a powder metallurgy near-α Ti–6Al–2Sn–4Zr–2Mo–0.5Y–0.5Si alloy. Thermal exposure at 600 °C for 200 h induces multiple microstructural changes, including fragmentation and partial dissolution of β layers, coarsening of α lamellae, and a reduction in the fraction of low-angle grain boundaries (LAGBs). It also promotes the precipitation of nanoscale (Ti,Zr)6Si3 silicides and Ti3Al (α2), both of which follow Lifshitz–Slyozov–Wagner (LSW) coarsening kinetics. At 600 °C/250 MPa, the 200 h-exposed sample exhibits a 75 % enhancement in creep life and a 44 % reduction in steady-state creep rate compared to its counterpart without thermal exposure. This improvement in creep resistance is attributed to the synergistic effects of multiple microstructural mechanisms. Specifically, silicides promote interfacial Zener pinning and Orowan dislocation bypassing, while Ti3Al particles contribute to anti-phase boundary (APB) shear resistance. Both types of precipitates hinder dislocation motion, suppress both dynamic recovery (DRV) and dynamic recrystallization (DRX) during creep, and promote dislocation accumulation. The microstructure after thermal exposure further strengthens the dominance of the dislocation climb mechanism during the creep process. These findings provide valuable insights for optimizing the microstructure design of high-temperature near-α titanium alloys. |
| format | Article |
| id | doaj-art-45d497fdacb445bba29ce455f02c9d1f |
| institution | Kabale University |
| issn | 2238-7854 |
| language | English |
| publishDate | 2025-09-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Journal of Materials Research and Technology |
| spelling | doaj-art-45d497fdacb445bba29ce455f02c9d1f2025-08-20T03:57:58ZengElsevierJournal of Materials Research and Technology2238-78542025-09-013893695110.1016/j.jmrt.2025.07.275Thermal exposure induced microstructural changes and associated creep property enhancement of a PM near-α Ti–6Al–2Sn–4Zr–2Mo–0.5Y–0.5Si alloyXuemei Yu0Fuyang Yu1Yan Wu2Xiuzhen Zhang3Xiaogang Wu4Bowen Zhang5Hongzhi Niu6Deliang Zhang7School of Material Science and Engineering, Northeastern University, Shenyang, 110819, ChinaSchool of Material Science and Engineering, Northeastern University, Shenyang, 110819, ChinaAnalytical and Testing Center, Northeastern University, Shenyang, 110819, ChinaSchool of Material Science and Engineering, Northeastern University, Shenyang, 110819, ChinaSchool of Material Science and Engineering, Northeastern University, Shenyang, 110819, ChinaSchool of Material Science and Engineering, Northeastern University, Shenyang, 110819, ChinaSchool of Material Science and Engineering, Northeastern University, Shenyang, 110819, ChinaSchool of Material Science and Engineering, Northeastern University, Shenyang, 110819, China; National Frontiers Science Center for Industrial Intelligence and Systems Optimization, Northeastern University, Shenyang, 110819, China; Key Laboratory of Silicon-based Materials, The Ministry of Education, Key Laboratory of Automotive Glass of Fujian, Smart Automotive Glass Engineering Research Center of Fujian, And School of Materials Science and Engineering, Fuyao University of Science and Technology, Fuzhou, 350109, China; Corresponding author. School of Material Science and Engineering, Northeastern University, Shenyang, 110819, China.This study investigates the effects of thermal exposure on the microstructure and creep behavior of a powder metallurgy near-α Ti–6Al–2Sn–4Zr–2Mo–0.5Y–0.5Si alloy. Thermal exposure at 600 °C for 200 h induces multiple microstructural changes, including fragmentation and partial dissolution of β layers, coarsening of α lamellae, and a reduction in the fraction of low-angle grain boundaries (LAGBs). It also promotes the precipitation of nanoscale (Ti,Zr)6Si3 silicides and Ti3Al (α2), both of which follow Lifshitz–Slyozov–Wagner (LSW) coarsening kinetics. At 600 °C/250 MPa, the 200 h-exposed sample exhibits a 75 % enhancement in creep life and a 44 % reduction in steady-state creep rate compared to its counterpart without thermal exposure. This improvement in creep resistance is attributed to the synergistic effects of multiple microstructural mechanisms. Specifically, silicides promote interfacial Zener pinning and Orowan dislocation bypassing, while Ti3Al particles contribute to anti-phase boundary (APB) shear resistance. Both types of precipitates hinder dislocation motion, suppress both dynamic recovery (DRV) and dynamic recrystallization (DRX) during creep, and promote dislocation accumulation. The microstructure after thermal exposure further strengthens the dominance of the dislocation climb mechanism during the creep process. These findings provide valuable insights for optimizing the microstructure design of high-temperature near-α titanium alloys.http://www.sciencedirect.com/science/article/pii/S2238785425019337Near-α titanium alloyPowder metallurgyThermal exposureCreep behavior |
| spellingShingle | Xuemei Yu Fuyang Yu Yan Wu Xiuzhen Zhang Xiaogang Wu Bowen Zhang Hongzhi Niu Deliang Zhang Thermal exposure induced microstructural changes and associated creep property enhancement of a PM near-α Ti–6Al–2Sn–4Zr–2Mo–0.5Y–0.5Si alloy Journal of Materials Research and Technology Near-α titanium alloy Powder metallurgy Thermal exposure Creep behavior |
| title | Thermal exposure induced microstructural changes and associated creep property enhancement of a PM near-α Ti–6Al–2Sn–4Zr–2Mo–0.5Y–0.5Si alloy |
| title_full | Thermal exposure induced microstructural changes and associated creep property enhancement of a PM near-α Ti–6Al–2Sn–4Zr–2Mo–0.5Y–0.5Si alloy |
| title_fullStr | Thermal exposure induced microstructural changes and associated creep property enhancement of a PM near-α Ti–6Al–2Sn–4Zr–2Mo–0.5Y–0.5Si alloy |
| title_full_unstemmed | Thermal exposure induced microstructural changes and associated creep property enhancement of a PM near-α Ti–6Al–2Sn–4Zr–2Mo–0.5Y–0.5Si alloy |
| title_short | Thermal exposure induced microstructural changes and associated creep property enhancement of a PM near-α Ti–6Al–2Sn–4Zr–2Mo–0.5Y–0.5Si alloy |
| title_sort | thermal exposure induced microstructural changes and associated creep property enhancement of a pm near α ti 6al 2sn 4zr 2mo 0 5y 0 5si alloy |
| topic | Near-α titanium alloy Powder metallurgy Thermal exposure Creep behavior |
| url | http://www.sciencedirect.com/science/article/pii/S2238785425019337 |
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