The Use of the Non-Contacting Temperature Measuring Techniques in the Early Detection of Hidden Faults in Electronic Components
Saved in:
Main Author: | P. Trägner |
---|---|
Format: | Article |
Language: | English |
Published: |
Wiley
1984-01-01
|
Series: | Active and Passive Electronic Components |
Online Access: | http://dx.doi.org/10.1155/APEC.11.197 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Effect of Firing Temperature and Glass Content on the Electrical Properties of Thick Film Capacitors
by: A. Uusimäki, et al.
Published: (1982-01-01) -
Experimental setup for studying the effect of dustiness in case of non-contact temperature measurements
by: N. S. Chernysheva, et al.
Published: (2018-04-01) -
Simulation of the effect of absorption by atmospheric water vapor on the results of non-contact temperature measurements
by: A. B. Ionov, et al.
Published: (2023-09-01) -
Non-Contact Thermophysical Property Measurements of High-Temperature Corium Through Aerodynamic Levitation
by: Yaopeng Gong, et al.
Published: (2025-01-01) -
Research of the Fault Diagnosis and Pattern Recognition based on Delayed Correlation-Envelope Technique and Hidden Markov Model
by: Liu Xin, et al.
Published: (2015-01-01)