Digital Twin for Developing and Verifying Semiconductor Packaging License Models
The traditional semiconductor packaging training process is time-consuming and carries the risk of damaging precision equipment due to improper operation. Additionally, the retirement of experienced trainers has led to loss of specialized training and testing expertise. To address these challenges,...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-04-01
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| Series: | Engineering Proceedings |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2673-4591/89/1/45 |
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