Digital Twin for Developing and Verifying Semiconductor Packaging License Models
The traditional semiconductor packaging training process is time-consuming and carries the risk of damaging precision equipment due to improper operation. Additionally, the retirement of experienced trainers has led to loss of specialized training and testing expertise. To address these challenges,...
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| Format: | Article |
| Language: | English |
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MDPI AG
2025-04-01
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| Series: | Engineering Proceedings |
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| Online Access: | https://www.mdpi.com/2673-4591/89/1/45 |
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| author | Lai-Chung Lee Shou-Yen Zhao Whei-Jane Wei |
| author_facet | Lai-Chung Lee Shou-Yen Zhao Whei-Jane Wei |
| author_sort | Lai-Chung Lee |
| collection | DOAJ |
| description | The traditional semiconductor packaging training process is time-consuming and carries the risk of damaging precision equipment due to improper operation. Additionally, the retirement of experienced trainers has led to loss of specialized training and testing expertise. To address these challenges, digital twin technology is applied to training packaging engineers. We conducted an empirical study at the packaging production line of the Minghsin University of Science and Technology to address talent training bottlenecks and imbalances between supply and demand. First, an integrated software and hardware system was designed by combining digital twin and mixed reality (MR). The development process of the digital twin system for the wafer-dicing machine includes on-site visits, machine operation instructions, certification content development, expert validity construction, small-scale testing and modifications. We compared the pre- and post-experiment scores of industry experts to evaluate the operation time of five participants and their feedback. Digital twin and MR for simulated training increased proficiency in operation. The digital twin training and certification model developed in this study improved students’ pass rates in certification exams. |
| format | Article |
| id | doaj-art-41a1cd3ec2e149cdb21fa54774fde04e |
| institution | OA Journals |
| issn | 2673-4591 |
| language | English |
| publishDate | 2025-04-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Engineering Proceedings |
| spelling | doaj-art-41a1cd3ec2e149cdb21fa54774fde04e2025-08-20T02:24:25ZengMDPI AGEngineering Proceedings2673-45912025-04-018914510.3390/engproc2025089045Digital Twin for Developing and Verifying Semiconductor Packaging License ModelsLai-Chung Lee0Shou-Yen Zhao1Whei-Jane Wei2Department of Multimedia and Game Development, Minghsin University of Science and Technology, Hsinchu 30401, TaiwanDepartment of Multimedia and Game Development, Minghsin University of Science and Technology, Hsinchu 30401, TaiwanDepartment of Multimedia and Game Development, Minghsin University of Science and Technology, Hsinchu 30401, TaiwanThe traditional semiconductor packaging training process is time-consuming and carries the risk of damaging precision equipment due to improper operation. Additionally, the retirement of experienced trainers has led to loss of specialized training and testing expertise. To address these challenges, digital twin technology is applied to training packaging engineers. We conducted an empirical study at the packaging production line of the Minghsin University of Science and Technology to address talent training bottlenecks and imbalances between supply and demand. First, an integrated software and hardware system was designed by combining digital twin and mixed reality (MR). The development process of the digital twin system for the wafer-dicing machine includes on-site visits, machine operation instructions, certification content development, expert validity construction, small-scale testing and modifications. We compared the pre- and post-experiment scores of industry experts to evaluate the operation time of five participants and their feedback. Digital twin and MR for simulated training increased proficiency in operation. The digital twin training and certification model developed in this study improved students’ pass rates in certification exams.https://www.mdpi.com/2673-4591/89/1/45digital twinmixed reality semiconductor packagingverification |
| spellingShingle | Lai-Chung Lee Shou-Yen Zhao Whei-Jane Wei Digital Twin for Developing and Verifying Semiconductor Packaging License Models Engineering Proceedings digital twin mixed reality semiconductor packaging verification |
| title | Digital Twin for Developing and Verifying Semiconductor Packaging License Models |
| title_full | Digital Twin for Developing and Verifying Semiconductor Packaging License Models |
| title_fullStr | Digital Twin for Developing and Verifying Semiconductor Packaging License Models |
| title_full_unstemmed | Digital Twin for Developing and Verifying Semiconductor Packaging License Models |
| title_short | Digital Twin for Developing and Verifying Semiconductor Packaging License Models |
| title_sort | digital twin for developing and verifying semiconductor packaging license models |
| topic | digital twin mixed reality semiconductor packaging verification |
| url | https://www.mdpi.com/2673-4591/89/1/45 |
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