Efficient Modeling Framework for FO-WLP Solder Interconnect Behavior During Thermal Cycling
In advanced microelectronic packaging, high thermo-mechanical loads arise on the solder interconnects. Accurate and efficient modeling of the mechanical behavior is crucial in the design of the package, and the simulation results can provide a basis for estimations of the reliability of the assembly...
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| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2024-12-01
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| Series: | Metals |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2075-4701/15/1/17 |
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