Cruz, R. S. V., & Gonda, V. Efficient Modeling Framework for FO-WLP Solder Interconnect Behavior During Thermal Cycling. MDPI AG.
Chicago Style (17th ed.) CitationCruz, Ramiro Sebastian Vargas, and Viktor Gonda. Efficient Modeling Framework for FO-WLP Solder Interconnect Behavior During Thermal Cycling. MDPI AG.
MLA (9th ed.) CitationCruz, Ramiro Sebastian Vargas, and Viktor Gonda. Efficient Modeling Framework for FO-WLP Solder Interconnect Behavior During Thermal Cycling. MDPI AG.
Warning: These citations may not always be 100% accurate.