Magnetron-Sputtered and Rapid-Thermally Annealed NiO:Cu Thin Films on 3D Porous Substrates for Supercapacitor Electrodes
The performance of NiO-based supercapacitor electrodes for energy storage systems was enhanced by doping Cu into NiO thin films (200 nm) using radio-frequency magnetron co-sputtering on 3D porous Ni foam substrates, followed by rapid thermal annealing. The Hall effect measurements demonstrated enhan...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-05-01
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| Series: | Energies |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1996-1073/18/11/2704 |
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| Summary: | The performance of NiO-based supercapacitor electrodes for energy storage systems was enhanced by doping Cu into NiO thin films (200 nm) using radio-frequency magnetron co-sputtering on 3D porous Ni foam substrates, followed by rapid thermal annealing. The Hall effect measurements demonstrated enhanced electrical conductivity, with resistivity values of 1.244 × 10<sup>−4</sup> Ω·cm. The 3D porous NiO:Cu electrodes significantly increased the specific capacitance and achieved a value of 1809.2 Fg<sup>−1</sup>, with the NiO:Cu (10 at% Cu) thin films at a scan rate of 5 mVs<sup>−1</sup>, which is a 2.67-fold increase compared with the undoped NiO films on a glass substrate. The 3D porous NiO:Cu electrodes significantly improved the electrochemical properties of the NiO-based electrode, which resulted in a higher specific capacitance for enhancing the energy storage performance during grid stabilization. |
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| ISSN: | 1996-1073 |