Modulation of the electromagnetic shielding effectiveness through micro/macrostructure design for electronic packaging

Modulation of the electromagnetic shielding effectiveness through micro/macrostructure design for electronic packaging

Abstract Lightweight electronic packaging that provides mechanical protection, cooling ability, and customizable electromagnetic interference (EMI) shielding effectiveness (SE) is needed for next-generation electronics. Although electronic packaging solutions with excellent EMI SE exist, there is li...

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Bibliographic Details
Main Authors: Lizhi Guan, Jingbo Fan, Zhi Kai Ng, Edwin Hang Tong Teo, Hortense Le Ferrand
Format: Article
Language:English
Published: Nature Portfolio 2024-07-01
Series:NPG Asia Materials
Online Access:https://doi.org/10.1038/s41427-024-00554-8
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