Temperature Effects in Packaged RF MEMS Switches with Optimized Gold Electroplating Process
Due to its excellent electrical performance, mechanical reliability, and thermal stability, electroplated gold is still the most commonly used material for movable beams in RF MEMS switches. This paper investigates the influence of process conditions on the quality and growth rate of gold electropla...
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| Language: | English |
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MDPI AG
2024-08-01
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| Series: | Micromachines |
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| Online Access: | https://www.mdpi.com/2072-666X/15/9/1085 |
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| author | Lifeng Wang Lili Jiang Ning Ma Xiaodong Huang |
| author_facet | Lifeng Wang Lili Jiang Ning Ma Xiaodong Huang |
| author_sort | Lifeng Wang |
| collection | DOAJ |
| description | Due to its excellent electrical performance, mechanical reliability, and thermal stability, electroplated gold is still the most commonly used material for movable beams in RF MEMS switches. This paper investigates the influence of process conditions on the quality and growth rate of gold electroplating, and the optimized process parameters for the gold electroplating process are obtained. The characterization of the optimized electroplated gold layer shows that it has small surface roughness and excellent thermal stability. With this optimized gold electroplating process, the RF MEMS switches are fabricated and hermetic packaged. In order to obtain the temperature environment adaptability of the packaged switch, the influence of working temperature is studied. The temperature effects on mechanical performance (includes pull-in voltage and lifetime) and RF performance (includes insertion loss and isolation) are revealed. |
| format | Article |
| id | doaj-art-3ee78f97d3f54bf697f9b57f2fc73b03 |
| institution | OA Journals |
| issn | 2072-666X |
| language | English |
| publishDate | 2024-08-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Micromachines |
| spelling | doaj-art-3ee78f97d3f54bf697f9b57f2fc73b032025-08-20T01:55:41ZengMDPI AGMicromachines2072-666X2024-08-01159108510.3390/mi15091085Temperature Effects in Packaged RF MEMS Switches with Optimized Gold Electroplating ProcessLifeng Wang0Lili Jiang1Ning Ma2Xiaodong Huang3Key Laboratory of MEMS of the Ministry of Education, School of Electronic Science & Engineering, Southeast University, Nanjing 210096, ChinaKey Laboratory of MEMS of the Ministry of Education, School of Electronic Science & Engineering, Southeast University, Nanjing 210096, ChinaKey Laboratory of MEMS of the Ministry of Education, School of Electronic Science & Engineering, Southeast University, Nanjing 210096, ChinaKey Laboratory of MEMS of the Ministry of Education, School of Electronic Science & Engineering, Southeast University, Nanjing 210096, ChinaDue to its excellent electrical performance, mechanical reliability, and thermal stability, electroplated gold is still the most commonly used material for movable beams in RF MEMS switches. This paper investigates the influence of process conditions on the quality and growth rate of gold electroplating, and the optimized process parameters for the gold electroplating process are obtained. The characterization of the optimized electroplated gold layer shows that it has small surface roughness and excellent thermal stability. With this optimized gold electroplating process, the RF MEMS switches are fabricated and hermetic packaged. In order to obtain the temperature environment adaptability of the packaged switch, the influence of working temperature is studied. The temperature effects on mechanical performance (includes pull-in voltage and lifetime) and RF performance (includes insertion loss and isolation) are revealed.https://www.mdpi.com/2072-666X/15/9/1085RF MEMS switchgold electroplating processtemperature effectspull-in voltagelifetime |
| spellingShingle | Lifeng Wang Lili Jiang Ning Ma Xiaodong Huang Temperature Effects in Packaged RF MEMS Switches with Optimized Gold Electroplating Process Micromachines RF MEMS switch gold electroplating process temperature effects pull-in voltage lifetime |
| title | Temperature Effects in Packaged RF MEMS Switches with Optimized Gold Electroplating Process |
| title_full | Temperature Effects in Packaged RF MEMS Switches with Optimized Gold Electroplating Process |
| title_fullStr | Temperature Effects in Packaged RF MEMS Switches with Optimized Gold Electroplating Process |
| title_full_unstemmed | Temperature Effects in Packaged RF MEMS Switches with Optimized Gold Electroplating Process |
| title_short | Temperature Effects in Packaged RF MEMS Switches with Optimized Gold Electroplating Process |
| title_sort | temperature effects in packaged rf mems switches with optimized gold electroplating process |
| topic | RF MEMS switch gold electroplating process temperature effects pull-in voltage lifetime |
| url | https://www.mdpi.com/2072-666X/15/9/1085 |
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