Experimental study on the thermal effects in shear-driven liquid film evaporation under dynamic boundary conditions
In semiconductor manufacturing processes, under shear conditions, deionized water tends to retain a liquid film on the wafer surface due to interfacial interactions. This phenomenon arises from the dynamic balance between shear-induced fluid motion and adhesion forces at the solid–liquid interface,...
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| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
AIP Publishing LLC
2025-04-01
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| Series: | AIP Advances |
| Online Access: | http://dx.doi.org/10.1063/5.0268385 |
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