Material-Mechanistic Interplay in SiCN Wafer Bonding for 3D Integration
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| Main Authors: | , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
American Chemical Society
2025-06-01
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| Series: | ACS Omega |
| Online Access: | https://doi.org/10.1021/acsomega.5c03628 |
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| ISSN: | 2470-1343 |
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