Tailoring the strength-conductivity combination in Cu matrix composites via in-situ TiB2 synthesis
Optimal interfacial bonding coupled with outstanding strengthening efficiency of reinforcement remains the cornerstone for developing high-performance Cu matrix composites. This study focuses on modulating both interface characteristics and microstructural architecture through in-situ processing, ai...
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| Main Authors: | , , , , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-09-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785425018502 |
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| Summary: | Optimal interfacial bonding coupled with outstanding strengthening efficiency of reinforcement remains the cornerstone for developing high-performance Cu matrix composites. This study focuses on modulating both interface characteristics and microstructural architecture through in-situ processing, aiming to achieve a strength-conductivity balance in Cu matrix composites. Fabricated via direct current resistance sintering, the in situ TiB2/Cu composites exhibit increasing yield strength from 174 MPa to 388 MPa with increasing TiB2 content, achieving a 155.9 %–470.6 % enhancement over pure Cu while maintaining room-temperature thermal conductivity exceeding 200 W/m·K. Notably, these in-situ composites achieve superior strength-conductivity synergy compared to both conventional Cu matrix composites and Cu alloys reported in existing literature. This is attributed to the in-situ process regulation achieving: semi-coherent interfacial bonding, grain refinement (98 % refinement), dislocation strengthening (32.6-fold multiplication in dislocation density), and effective load transfer. Complementary mesomechanical simulations demonstrate that composite damage primarily originates from stress-strain concentration within the interparticle matrix regions, with matrix ductile fracture dominating the failure mode, and no significant interfacial debonding observed. These findings establish a theoretical framework for designing Cu matrix composites with exceptional strength-conductivity properties. |
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| ISSN: | 2238-7854 |