The Impact of Gas Cluster Ion Beam Sputtering on the Chemical and Electronic Structure of Methyl Ammonium Lead Iodide Thin Films

Abstract The stability and performance of metal halide perovskite (MHP) optoelectronic devices are significantly influenced by the chemical and electronic properties of their interfaces, often studied using photoelectron spectroscopy (PES). MHP films, containing organic cations, are susceptible to s...

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Main Authors: Emily Albert, Fengshuo Zu, Dongguen Shin, Patrick Amsalem, Norbert Koch
Format: Article
Language:English
Published: Wiley-VCH 2025-06-01
Series:Advanced Materials Interfaces
Subjects:
Online Access:https://doi.org/10.1002/admi.202500102
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author Emily Albert
Fengshuo Zu
Dongguen Shin
Patrick Amsalem
Norbert Koch
author_facet Emily Albert
Fengshuo Zu
Dongguen Shin
Patrick Amsalem
Norbert Koch
author_sort Emily Albert
collection DOAJ
description Abstract The stability and performance of metal halide perovskite (MHP) optoelectronic devices are significantly influenced by the chemical and electronic properties of their interfaces, often studied using photoelectron spectroscopy (PES). MHP films, containing organic cations, are susceptible to surface modifications under common experimental conditions, necessitating careful analysis. This study examines the effects of argon gas cluster ion beam (GCIB) sputtering, considered gentler and more suitable for depth‐profiling than standard argon ion sputtering, on methylammonium lead iodide using PES. Long‐term exposure to argon clusters with 3.2 and 1.5 eV per Ar atom causes significant degradation, including cation loss and metallic lead formation. However, short‐term exposure (<60 min) at 1.5 eV per Ar atom effectively reduces surface contamination without noticeable degradation, allowing access to intrinsic electronic properties. This gentle cleaning reveals a 220 meV energy difference between the contaminated surface and the valence band onset of the intrinsic MHP potentially improving energy level alignment with electron transport layers. These results demonstrate that low energy GCIB sputtering can serve as a non‐destructive surface cleaning method, enhancing PES investigations and supporting fundamental device studies of MHPs.
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spelling doaj-art-3c3966d54d5b45b59dacdcf10d56c3462025-08-20T02:38:18ZengWiley-VCHAdvanced Materials Interfaces2196-73502025-06-011212n/an/a10.1002/admi.202500102The Impact of Gas Cluster Ion Beam Sputtering on the Chemical and Electronic Structure of Methyl Ammonium Lead Iodide Thin FilmsEmily Albert0Fengshuo Zu1Dongguen Shin2Patrick Amsalem3Norbert Koch4Institut für Physik & IRIS Adlershof Humboldt‐Universität zu Berlin 12489 Berlin GermanyInstitut für Physik & IRIS Adlershof Humboldt‐Universität zu Berlin 12489 Berlin GermanyInstitut für Physik & IRIS Adlershof Humboldt‐Universität zu Berlin 12489 Berlin GermanyInstitut für Physik & IRIS Adlershof Humboldt‐Universität zu Berlin 12489 Berlin GermanyInstitut für Physik & IRIS Adlershof Humboldt‐Universität zu Berlin 12489 Berlin GermanyAbstract The stability and performance of metal halide perovskite (MHP) optoelectronic devices are significantly influenced by the chemical and electronic properties of their interfaces, often studied using photoelectron spectroscopy (PES). MHP films, containing organic cations, are susceptible to surface modifications under common experimental conditions, necessitating careful analysis. This study examines the effects of argon gas cluster ion beam (GCIB) sputtering, considered gentler and more suitable for depth‐profiling than standard argon ion sputtering, on methylammonium lead iodide using PES. Long‐term exposure to argon clusters with 3.2 and 1.5 eV per Ar atom causes significant degradation, including cation loss and metallic lead formation. However, short‐term exposure (<60 min) at 1.5 eV per Ar atom effectively reduces surface contamination without noticeable degradation, allowing access to intrinsic electronic properties. This gentle cleaning reveals a 220 meV energy difference between the contaminated surface and the valence band onset of the intrinsic MHP potentially improving energy level alignment with electron transport layers. These results demonstrate that low energy GCIB sputtering can serve as a non‐destructive surface cleaning method, enhancing PES investigations and supporting fundamental device studies of MHPs.https://doi.org/10.1002/admi.202500102energy level alignmentgas cluster ion beamsinterfacialmetal halide perovskitesphotoelectron spectroscopy
spellingShingle Emily Albert
Fengshuo Zu
Dongguen Shin
Patrick Amsalem
Norbert Koch
The Impact of Gas Cluster Ion Beam Sputtering on the Chemical and Electronic Structure of Methyl Ammonium Lead Iodide Thin Films
Advanced Materials Interfaces
energy level alignment
gas cluster ion beams
interfacial
metal halide perovskites
photoelectron spectroscopy
title The Impact of Gas Cluster Ion Beam Sputtering on the Chemical and Electronic Structure of Methyl Ammonium Lead Iodide Thin Films
title_full The Impact of Gas Cluster Ion Beam Sputtering on the Chemical and Electronic Structure of Methyl Ammonium Lead Iodide Thin Films
title_fullStr The Impact of Gas Cluster Ion Beam Sputtering on the Chemical and Electronic Structure of Methyl Ammonium Lead Iodide Thin Films
title_full_unstemmed The Impact of Gas Cluster Ion Beam Sputtering on the Chemical and Electronic Structure of Methyl Ammonium Lead Iodide Thin Films
title_short The Impact of Gas Cluster Ion Beam Sputtering on the Chemical and Electronic Structure of Methyl Ammonium Lead Iodide Thin Films
title_sort impact of gas cluster ion beam sputtering on the chemical and electronic structure of methyl ammonium lead iodide thin films
topic energy level alignment
gas cluster ion beams
interfacial
metal halide perovskites
photoelectron spectroscopy
url https://doi.org/10.1002/admi.202500102
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