Influences of Non-uniform Temperature Distribution on the Performance of Hot End of a Thermoelectric Refrigerator Chip
Thermoelectric cooler（TEC）chips do not work in an ideal condition with uniform temperature in engineering applications due to various reasons, which leads to local high-temperature region. A non-uniform temperature distribution was applied to simulate the working condition while a 3D finite element...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | zho |
| Published: |
Journal of Refrigeration Magazines Agency Co., Ltd.
2018-01-01
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| Series: | Zhileng xuebao |
| Subjects: | |
| Online Access: | http://www.zhilengxuebao.com/thesisDetails#10.3969/j.issn.0253-4339.2018.06.054 |
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| Summary: | Thermoelectric cooler（TEC）chips do not work in an ideal condition with uniform temperature in engineering applications due to various reasons, which leads to local high-temperature region. A non-uniform temperature distribution was applied to simulate the working condition while a 3D finite element method was used in the numerical analysis of TEC chips in the study. The influences of variations in the working temperature of the hot end（th：20~40 ℃）, maximum temperature difference （θm：5~30 ℃）, and area ratio of hot space （ω：7/16~12/16） on the performance of TEC chips were considered. The results indicate that the relative refrigerating capacity deviation reaches to -8.788%, the relative power deviation reaches to 2.608%, and the relative coefficient of performance (COP) reaches to -10.9%. |
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| ISSN: | 0253-4339 |