Dual‐Modal Sensing Skin Adaptive to Daylight, Darkness, and Ultraviolet Light for Simultaneous Full‐Field Deformation Measurement and Mechanoluminescence Responses

Abstract Mechanoluminescence (ML) and digital image correlation (DIC) have emerged as promising optical methods to visualize and measure deformation fields. In this study, a dual‐modal sensing skin, called the ML‐DIC skin is introduced, that is capable of emitting ML and facilitating DIC measurement...

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Bibliographic Details
Main Authors: Suman Timilsina, Cheol Woo Jo, Kwang Ho Lee, Kee‐Sun Sohn, Ji Sik Kim
Format: Article
Language:English
Published: Wiley 2025-01-01
Series:Advanced Science
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Online Access:https://doi.org/10.1002/advs.202409384
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Summary:Abstract Mechanoluminescence (ML) and digital image correlation (DIC) have emerged as promising optical methods to visualize and measure deformation fields. In this study, a dual‐modal sensing skin, called the ML‐DIC skin is introduced, that is capable of emitting ML and facilitating DIC measurements under various lighting conditions, including daylight, night or darkness, and UV irradiation. Four ML‐DIC skins are fabricated with or without carbon nanotubes (CNTs) using a composite powder consisting of SrAl2O4: Eu,Dy (SAO), and acrylic resin, with CNT milling times of 48, 72, and 96 h for three of four skins, respectively. DIC measurements are performed under multiple lighting conditions for measuring photoluminescence, persistence luminescence, and reflection. Uniaxial tension tests demonstrate the superior performance of ML‐DIC skins with CNTs compared with pristine SAO skins, with the skin subjected to 48 h of CNT dispersion exhibiting optimal performance. Further investigations focus on ML emission and DIC measurements near the crack‐tip vicinity of static and propagating cracks as well as on surfaces above subsurface cracks. The integration of ML and DIC techniques offers a versatile approach for comprehensive deformation analysis applicable to diverse environments, with implications for materials science, engineering, and structural health monitoring.
ISSN:2198-3844