Effectiveness of Electrode Design Methodologies for Fast EDM Slotting of Thick Silicon Wafers
Silicon is the most commonly used material in the electronic industries due to its unique properties, which also make it very difficult to machine using conventional machining. Electrical discharge machining (EDM) is a non-traditional process that is gaining popularity for machining silicon, althoug...
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MDPI AG
2025-06-01
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| author | Mahmud Anjir Karim Muhammad Pervej Jahan |
| author_facet | Mahmud Anjir Karim Muhammad Pervej Jahan |
| author_sort | Mahmud Anjir Karim |
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| description | Silicon is the most commonly used material in the electronic industries due to its unique properties, which also make it very difficult to machine using conventional machining. Electrical discharge machining (EDM) is a non-traditional process that is gaining popularity for machining silicon, although a slower machining rate is one of its limitations. This study investigates two electrode design strategies to enhance the efficiency of EDM by improving the material removal rates, reducing tool wear, and refining the quality of machined features. The first approach involves using graphite electrodes in various array configurations (1 × 4 to 6 × 4) and leg heights (0.2″ and 0.3″). The second approach employs hollow electrodes with differing wall thicknesses (0.04″, 0.08″, and 0.12″). The effects of these variables on performance were evaluated by maintaining constant EDM parameters. The results indicate that increasing the number of electrode legs improves the flushing conditions, resulting in shorter machining times. Meanwhile, the shorter electrode height outperforms the taller electrode, providing a higher machining speed. The thinnest wall thickness for hollow electrodes yielded the best performance due to the increased energy distribution. Both electrode design methodologies can be used for the mass fabrication of features with targeted profiles on silicon using the die-sinking EDM process. |
| format | Article |
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| spelling | doaj-art-3bec5bd4b99549559c82c72d1393a6b22025-08-20T02:23:08ZengMDPI AGApplied Sciences2076-34172025-06-011511637410.3390/app15116374Effectiveness of Electrode Design Methodologies for Fast EDM Slotting of Thick Silicon WafersMahmud Anjir Karim0Muhammad Pervej Jahan1Department of Mechanical and Manufacturing Engineering, Miami University, Oxford, OH 45056, USADepartment of Mechanical and Manufacturing Engineering, Miami University, Oxford, OH 45056, USASilicon is the most commonly used material in the electronic industries due to its unique properties, which also make it very difficult to machine using conventional machining. Electrical discharge machining (EDM) is a non-traditional process that is gaining popularity for machining silicon, although a slower machining rate is one of its limitations. This study investigates two electrode design strategies to enhance the efficiency of EDM by improving the material removal rates, reducing tool wear, and refining the quality of machined features. The first approach involves using graphite electrodes in various array configurations (1 × 4 to 6 × 4) and leg heights (0.2″ and 0.3″). The second approach employs hollow electrodes with differing wall thicknesses (0.04″, 0.08″, and 0.12″). The effects of these variables on performance were evaluated by maintaining constant EDM parameters. The results indicate that increasing the number of electrode legs improves the flushing conditions, resulting in shorter machining times. Meanwhile, the shorter electrode height outperforms the taller electrode, providing a higher machining speed. The thinnest wall thickness for hollow electrodes yielded the best performance due to the increased energy distribution. Both electrode design methodologies can be used for the mass fabrication of features with targeted profiles on silicon using the die-sinking EDM process.https://www.mdpi.com/2076-3417/15/11/6374fast EDM slottingsilicondie-sinking EDMelectrode designmaterial removal rate (MRR)EDM productivity |
| spellingShingle | Mahmud Anjir Karim Muhammad Pervej Jahan Effectiveness of Electrode Design Methodologies for Fast EDM Slotting of Thick Silicon Wafers Applied Sciences fast EDM slotting silicon die-sinking EDM electrode design material removal rate (MRR) EDM productivity |
| title | Effectiveness of Electrode Design Methodologies for Fast EDM Slotting of Thick Silicon Wafers |
| title_full | Effectiveness of Electrode Design Methodologies for Fast EDM Slotting of Thick Silicon Wafers |
| title_fullStr | Effectiveness of Electrode Design Methodologies for Fast EDM Slotting of Thick Silicon Wafers |
| title_full_unstemmed | Effectiveness of Electrode Design Methodologies for Fast EDM Slotting of Thick Silicon Wafers |
| title_short | Effectiveness of Electrode Design Methodologies for Fast EDM Slotting of Thick Silicon Wafers |
| title_sort | effectiveness of electrode design methodologies for fast edm slotting of thick silicon wafers |
| topic | fast EDM slotting silicon die-sinking EDM electrode design material removal rate (MRR) EDM productivity |
| url | https://www.mdpi.com/2076-3417/15/11/6374 |
| work_keys_str_mv | AT mahmudanjirkarim effectivenessofelectrodedesignmethodologiesforfastedmslottingofthicksiliconwafers AT muhammadpervejjahan effectivenessofelectrodedesignmethodologiesforfastedmslottingofthicksiliconwafers |